Back-End-of-Line Integration (BEoL)

Complete 300 mm BEoL Process Line

• Full access to production-like equipment to test innovations against matched Fab PORs
• Established flying wafer protocol (Fab – IPMS – Fab) allows partial or full flow coverage
• Streamlined processing with low Q-time for high sensitivity investigations
• Evaluation of sub 20nm structures and components

Our Expertise

Processes integration

• Alternative interconnect materials / substrates / concepts
• 14 nm BEol modules

Device integration

• NVM integration, e.g., FeFET, MRAM / Racetrack, RRAM
• Passive devices, e.g. Capacitor, Varactor