Fast Innovation through Research in Semiconductor Technologies
EUREF-Campus Gasometer
EUREF-Campus 17
10829 Berlin
FIRST – Fast Innovation through Research in Semiconductor Technologies is the European conference on semiconductor trends, advanced packaging, chiplets and strategic alignment. The decision-level forum brings together leaders from industry, research and policy to discuss semiconductor roadmaps, heterogeneous integration, design infrastructure and industrial implementation within the European semiconductor ecosystem and the EU Chips Act context. Information and registration: first-by-fmd.de
QMI technology offers significant advantages over conventional packaging processes. This is due to the way chiplets are arranged on an active or passive wafer substrate with a shared interconnect stack. Since the interconnects are formed in the front-end-of-line process, much higher connection densities can be achieved than with traditional methods. The following benefits result:
Heterointegration into quasi-monolithic integration
The development of a compact ultrasound camera offers an effective solution to these challenges. By utilizing highfrequency sound waves, it enables contactless and threedimensional visualization, improving both patient safety and industrial efficiency. This technology opens new perspectives for monitoring and analyzing movements and positions across various applications.
Fraunhofer Institute for Photonic Microsystems