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Fraunhofer Institute for Photonic Microsystems
Fraunhofer Institute for Photonic Microsystems
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Smart industrial solutions
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Diagnostics and Sensors
Medical Imaging
Mobility
Automotive
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Components and Systems
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Components and Systems
Sensors
Ultrasonic Sensors
Capacitive Micromachined Ultrasonic Transducer (CMUT)
Lateral Capacitive Micromechanical Ultrasonic Transducer (L-CMUT)
Piezoelectric Micromachined Ultrasonic Transducers (PMUT)
Optical Sensors
Automotive LiDAR Technology
Integrated Photonic Devices
Near-infrared spectroscopy
Optical Ring Resonator
Pyrosensors
Photodiodes
Chemical Sensors
Detection of volatile organics using MEMS-based ion mobility spectrometers (DoSIs)
Resource-efficient electrochemical analysis (REAL)
Electrical Sensors
Data Communication
Li-Fi Optical Data Transmission
Li-Fi-GigaDock
Li-Fi-HotSpot
IP-Core Design for FPGA and ASIC
Digital IP Core Modules
Analog and Mixed Signal IP Core Modules
FPGA and SoC Design Services
Automotive Network IP Core Designs
Computing
Memory Technology
Magnetoresistive RAM (MRAM)
Ferroelectric Field Effect Transistor (FeFET)
Ferroelectric RAM (FRAM)
Project: BIOSYNTH - Modular high-throughput microplatform for future synthetic biology mass data storage.
Energy Storage
Silicon Capacitors
Integrated Micro Batteries
300 mm Technology Modules & Test Chips
Nanopatterning
Metallization
RF Characterization
Actuators
Mechanical Actuators
Nanoscopic Electrostatic Drive – electrostatic MEMS bending transducer
Energy Harvesting
Micromachined Ultrasonic Transducer
MEMS based Micropositioning Platforms
Optical Actuators
MEMS scanners
Spatial Light Modulators
Tunable Microlenses
Liquid Crystal Waveguide
Services
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Services
MEMS Technologies Dresden
MEMS Capabilities
MEMS Cleanroom
MEMS Competencies
MEMS Offerings
Back End and Packaging
300 mm Semiconductor Processes
Nanopatterning
Atomic Layer Deposition (ALD)
Chemical Mechanical Planarization (CMP)
Wafer Metallization
Wafer Cleaning
300 mm Wafer Services
Evaluation Kits
MEMS Scanner Evaluation Kits
Diffractive MEMS Kit: Tilt Micro-Mirror Array
CMUT Evaluation Kit
LiFi-HotSpot Evaluation Kit
LiFi-GigaDock Evaluation Kit
Time Sensitive Networking Evaluation Kit
RISC-V Prozessor IP Core Evaluation Kit
Analytics and Characterization
Analytics and Metrology
RF Characterization
Research areas
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Research areas
Neuromorphic Computing
TEMPO - Technology and Hardware for Neuromorphic Computing
ANDANTE - Ai for New Devices And Technologies at the Edge
MEMION - Memristive Redox Transistors for Neuromorphic Computer Architectures
StorAIge - New storage technology for edge AI applications
SEC-Learn - Sensor Edge Cloud for Federated Learning
TKOS - Terahertz-Technologies
Trusted Electronics
Velektronik - Platform for trusted electronics
Silhouette - Silicon Photonics for trusted electronic components
TRAICT II – Trusted resource aware ICT
TrEKISS - Trusted Edge AI for Multi-sensor systems
VE4 - Trusted fault management of energy networks
Quantum Computing
QUASAR - semiconductor quantum processor with shuttling-based scalable architecture
QLSI - Quantum Large-Scale Integration with Silicon
SUQCES - Manufacturing scalable and industry-compatible quantum computing approaches.
HalQ - Semiconductor-based quantum computing
MATQu - Materials for Quantum Computing
PhoQuant - Photonic Quantum Computer
QSolid - Quantum computer in the solid state
Quantum Communication & Quantum Cryptography
Quant-ID - Quantum Secure Identities for a Digital Future
QuINSiDa - Quantum-based infrastructure networks for safety-critical wireless data communication
Green ICT / Green IT
Environmentally friendly cleaning technologies in microchip production
Media Hub
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Media Hub
Press Releases
Archive
Year 2020
Optical microsystems
X-ray photoelectron spectrometer at Fraunhofer IPMS
Real-time communication for automobiles
Covid-19 Statement
Micro loudspeaker made from silicon
NED audio technology for the market
Fraunhofer IPMS presents communication solutions for modern production
Fraunhofer IPMS develops IP designs for data control
Fraunhofer IPMS develops TSN Switch IP Core
M3 Infekt - Decentralized monitoring of COVID-19 patients
Year 2019
Press Release 2019-02-07
Press Release 2019-02-12
Press Release 2019-03-13
Press Release 2019-03-14
Press Release 2019-03-21
Press Release 2019-03-28
Press Release 2019-04-02
Gesture Recognition Using Ultrasound
Machine Perception - Scanning Eye Providing Robot Sight
Top marks for plastic bottle recycling system
Low-power Chips for AI Applications
More safety for driver assistance systems
Membrane-free MEMS Loudspeakers in Nature Microsystems and Nanoengineering scientific journal
Wireless and battery-free RFID sensor for switchgears
LiDAR technology for autonomous driving
Investments for Beyond-Moore process development and evaluation on 300 mm wafers
Wireless real-time communication via light - Wireless TSN via Li-Fi
Energy-efficient AI system
Year 2018
Year 2017
Year 2016
Year 2015
Press Release 2015-04-17
Year 2014
Year 2013
Year 2012
Year 2011
Year 2010
Year 2009
Year 2008
Year 2007
Year 2021
TSN IP core designs with low latency for automotive on-board networks
Fraunhofer IPMS is part of the European project ASCENT+
Thinking chips: Advanced materials and hardware for next generation computing
Scalable silicon qubits for quantum computers
Sensor platform for IoT and edge computing solutions
Trusted Electronics (Project Velektronik)
Energy-efficient sensor nodes from Fraunhofer
Ultrasonic measurement technology of the future
Towards a quantum processor "made in Germany"
Ultrasound sensor platform for SMEs
Reinforcement of the Institute Management at Fraunhofer IPMS
Project Silhouette launched
Terahertz technologies for visionary innovations
RISC-V Functional Safety Processor IP Core introduced by Fraunhofer IPMS and CAST
Innovative modeling approach for micro loudspeakers
Fraunhofer IPMS RISC-V processor core for functional safety
Stable European industry-scale fabrication value chains for solid-state-based quantum computer developmen
International Conference on Design and Technology in the IC Industry
Industrial automation and communication of the future
Zepowel: Das Internet der Dinge wird grüner
Fraunhofer IPMS presents a scalable TSN multiport switch at the TSN/A conference
Innovative Forschung soll Unternehmen in dünn besiedelten Regionen unterstützen
Noise-indicating lamp
Fraunhofer IPMS presents new technologies at the MST Congress
Innovative technologies for the industry
Year 2022
Risc-V-IP-Core-EMSA5-Lauterbach
Near infrared spectral analysis for mobile applications
Fraunhofer IPMS develops CANsec Controller IP-Core CAN-SEC
Fraunhofer IPMS develops demonstrator with gesture control for OZEANEUM in Stralsund
Miniaturized components of Fraunhofer IPMS
Trustworthy electronics "Made in Germany"
Kick-off for the "Green ICT @ FMD" competence center
Miniaturization saves energy in industrial automation
Modular high-throughput micro-platform for mass data storage of the future
Li-Fi GigaDock® Transceiver on ISS space station
Fraunhofer IPMS presents 200 and 300 mm technologies
Sensor and actuator-based signal preprocessing using AI-based methods
Photonics - Shining technology of the future
Research Fab for quantum and neuromorphic computing
Push-pull principle for loudspeaker concept
Year 2023
Annual Reports
Newsletter Subscription
Scientific publications
Whitepaper
Fraunhofer IPMS Webinars
Events
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Events
2016
ECOC 2016
Electronica
FachPack
Lange Nacht der Wissenschaften
Optatec
Semicon Europa
Semicon West
Sensor & Test
Sensors Expo
sps ipc drives
Vision
CNT - Industry Partner Day
Year 2017
Jahrestagung der DGaO
Embedded World
European MEMS Sensors Summit
Lange Nacht der Wissenschaften
Laser
LogiMAT
MST-Kongress
OFC
Photonics West
Photonix
RFID tomorrow
Sensor & Test
Sensors Expo
Smart Systems Integration
Semicon West
Semicon Europe
sps ipc drives
Fraunhofer IPMS - Industry Partner Day
Workshop LiFi
Year 2018
Analytica
Electronica
Embedded World
European MEMS Sensors Summit
Global LiFi Congress
Hannover Fair
IDTechEX
Lange Nacht der Wissenschaften
LogiMAT
OFC
Optatec
Photonics West
Photonik-Tage Berlin-Brandenburg
Photonix
RFID Journal live
RFID tomorrow
Semicon West
Sensor & Test
Sensors Expo
sps ipc drives
Smart Systems Integration
Smart SysTech
Carbon Nanotubes Workshop @DATE 2018
Technologietag Angewandte Sensorik
Vision
Year 2019
Fraunhofer IPMS - Industry Partner Day
LiFi '19
RFID '19
Automate
Embedded World
Hannover Fair
LogiMAT
OASIS
OFC
Photonics West
RFID Journal live
Smart Systems Integration
Industry Partner Day
Lange Nacht der Wissenschaften
Laser
Sensor & Test
Semicon West
European MEMS Sensors Summit
Automotive LIDAR
RFID tomorrow
MST-Kongress
Miroctech Innovation Summit
Productronica
sps ipc drives
Photonix
TSN/A Conference
GTC
Year 2020
Photonix West
LiFi-Workshops 2020
Sensor und Test
Lange Nacht der Wissenschaften Dresden
Embedded World 2020
Hannovermesse
Automotive Ethernet Congress
MEMS & Imaging Sensors Summit
Medical Wearables
Industry Partner Day 2020
Corona
Semicon West
TSN/A Conference
electronica
Semicon Europe
COMPAMED
Optatec
Photonix - cancelled
SPS
Webinar MEOS
Digitaltag 2020
Vehicle Environment Detection
INDUSTRIAL production + handling
GTC
Bordnetz Kongress
Fraunhofer Solution Days
IEDM Conference 2020
Year 2021
Technology Unites
Automotive Ethernet Congress
SPIE Photonics West
SPIE Photonics West
Semicon Europa
Photonix
MicroFab Summit
International Conference on IC Design and Technology 2021
Medical Wearables
all about automation
TSN/A Conference
SPIE Photonics West
Spatial Light Modulators – Status and Potential for Holography
Webinar: Material development for MRAM and FRAM stacks
Year 2022
Embedded World
SPIE Photonics West
Sensor + Test
OFC
analytica
MEMS Manufacturing
Laser - World of Photonics
Dresden Science Night
All About Automation
World of QUANTUM
Semicon Europa
MEDICA
Photonix
electronica
MEMS & Imaging Sensors Summit 2022
Year 2023
SPIE Photonics West
OFC 2023
embedded World 2023
Sensor + Test
Laser - World of Photonics
MikroSystemTechnik Kongress
Semicon Europa
MEDICA
Night of the Sciences Dresden
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Fraunhofer Institute for Photonic Microsystems