Quantum Sensing – CMOS-Integrated NV Technology for the Next Generation of Quantum Sensing
Quantum sensing is considered a key driver of innovation within modern quantum technologies. With CMOS-integrated NV sensors, Fraunhofer IPMS is developing a platform that enables highly sensitive quantum magnetometry at room temperature while leveraging the scalability, robustness, and energy efficiency of modern microelectronics. This combination of quantum metrology, photonics, and industry-compatible CMOS technology opens up new application perspectives in research, medical technology, industry, energy infrastructure, and navigation.
Application Areas – From 2D Materials to GPS-Free Navigation
CMOS-integrated quantum sensors address fields where access has previously been limited due to physical constraints or the complexity of optical laboratory systems. In materials and solid-state research, they enable the visualization of magnetic textures and local current flows in 2D materials with high spatial resolution. At the same time, they open new avenues in medical diagnostics and bioelectronics—for example, for precise heart and nerve monitoring or, prospectively, for brain-machine interfaces that rely on continuous, highly sensitive measurement data.
Significant added value also arises for energy and industrial networks: contactless current and field measurements can, for the first time, be transferred into portable and energy-efficient form factors thanks to high miniaturization and robust system integration. In geophysics, the sensors allow detection of local disturbances in the Earth's magnetic field, which is relevant for exploration and prospective mineral searches. Last but not least, the combination of NV technology and CMOS electronics creates new opportunities in navigation—particularly in GPS-denied scenarios or for high-precision indoor localization.
Technology – How the Sensor Is Made
The sensor platform is based on a CMOS backplane from an industrial foundry, which is then expanded at Fraunhofer IPMS through wafer-based post-processing into a complete quantum sensor unit. On this so-called frontplane, we integrate OLED light sources directly onto silicon, prospectively complemented by photodetectors and a chip-based microwave antenna to excite the NV centers. The diamond-based quantum sensor film is then applied and precisely aligned with the pixel fields. This monolithic integration forms the foundation for compact, energy-efficient, and scalable quantum sensing modules.
Advantages – Why This Technology Opens New Paths
Compared to established quantum sensors, such as SQUID systems, our sensors do not require cryogenics and operate stably at room temperature. By fully integrating all functional modules—light source, microwave control, photodetection, and readout electronics—a system is created with minimal power consumption and a form factor that goes far beyond traditional laboratory solutions. Furthermore, instead of single measurement points, multi-channel arrays enable multidimensional, potentially imaging-capable detection of magnetic fields down to the micrometer scale. The elimination of external lasers, optics, and complex alignment mechanisms significantly increases robustness and portability, enabling field applications that were previously technically difficult or impossible.