Semiconductor Process Services

RXRF, SEM and inline characterization for 200 mm and 300 mm.

CMP processes development for new materials to fulfill the demands of the next gen technology nodes for 200 mm and 300 mm.

Deposition via CVD, PVD, ALD and EPI, available for 200 mm & 300 mm.

200 mm deep reactive ion etching (DRIE), metals, oxides, nitrides, etc.

Precision nanopatterning for 200-mm and 300-mm wafers enabling sub-40-nm features via advanced lithography and electron-beam processes research and industrial applications.

Backend Assemnly, waferbonding, dicing, packaging and heterointegration for 200 mm.

300 mm ECD process development for galvanic deposition of metal layers through electrolyte screening, bath life time investigation and process characterization.

Screening and optimization of new chemicals and processes from laboratory scale up to 2x nm node test wafer evaluation for 200 mm and 300 mm.