Fraunhofer IPMS and BASF celebrate ten years of collaboration / 2024
Improved materials for microchip interconnections
More power, more energy-efficiency, more complexity - manufacturers of modern microchips are constantly facing new challenges, also regarding the electrical connections required. Fraunhofer IPMS and BASF have been working together on this problem for ten years. The teams have pooled their infrastructure and expertise and thus have made it possible to evaluate chemicals, processes and product tests for chip integration on an industrial scale.
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