Press Releases

Vuzix® Corporation (NASDAQ: VUZI), ("Vuzix" or, the "Company"), a leading supplier of Smart Glasses and Augmented Reality (AR) technology and products, and Fraunhofer Institute for Photonic Microsystems IPMS (Fraunhofer IPMS), a globally renowned research institution based in Germany, are excited to announce a major milestone in the development of a custom microLED backplane.

A common method to increase the brightness of OLEDs while maintaining a long lifespan is the use of multiple stacked OLEDs. Scientists at the Fraunhofer Institute for Photonic Microsystems IPMS have now developed an innovative high-voltage CMOS backplane that enables exceptionally bright microdisplays. These will be presented for the first time at the SID Display Week 2025, from May 13 to 15, 2025, in San José, USA (Booth No. 1135 at the German Pavilion).

A newly launched interdisciplinary research project involving universities of Brandenburg and research institutions is developing new technological approaches for better and more effective integration of artificial intelligence at the edges of IT networks, so-called “edges”. These developments could be of great importance in the future, particularly for applications in industrial electronics, medical technology and environmental monitoring. Fraunhofer IPMS is contributing its expertise in miniaturized sensor structures and the integration of electronic components.

Reliability and security in broadband communication networks (5G/6G) are crucial for meeting the challenges of the digital future. Together with aconnic AG, Fraunhofer IPMS has developed an innovative IP core as part of the “RealSec5G” project, which combines the advantages of a MACsec IP core with those of a Time-Sensitive Networking (TSN) IP core. This is the first time that the aspects of functional safety and data security in data transmission, which were usually considered separately, have been combined.

The Fraunhofer Institute for Photonic Microsystems IPMS has achieved another milestone in chemical liquid analysis. The electronics required to control the ion-sensitive field effect transistors (ISFET) have been successfully miniaturized. At the same time, manufacturing costs and power consumption have been reduced significantly. The new electronics can be made available for direct use or for integration into in-house measuring systems.

The Center Nanoelectronic Technologies (CNT) at Fraunhofer IPMS has recently acquired new cryostats for the research on qubits and the qualification of superconducting systems. The cryogenic measuring devices, which are particularly useful for analyzing quantum systems, are now in full operation. The provision of the equipment was funded by the Saxon State Ministry for Science, Culture and Tourism (SMWK).

Due to the increasing miniaturization and complexity in the semiconductor industry, but also in many other technical sectors and industries, high-precision and effective ways of projecting light, processing materials or sending optical signals are required - with precision in the nanometer range and high programming speed at the same time. The spatial light modulators of Fraunhofer IPMS already enable applications in the field of semiconductor technology today, thanks to customized tilting and piston mirror systems. They have the potential to become key components for future applications in material processing, 3D holographic display technology or imaging in biomedicine.

Particularly in medicine and bioanalytics, results must be determined precisely and reliably. The optical systems of Fraunhofer IPMS enable position control and gentle analysis options, which realize precise results in the shortest amount of time. The versatile applications of micro scanners in medicine include image acquisition for medical endoscopes, confocal microscopy, fluorescence microscopy and spectroscopy.

Researchers at the Fraunhofer Institute for Photonic Microsystems IPMS have developed novel OLED stacks that enable exceptionally bright microdisplays. These will be presented for the first time at SPIE AR VR MR 2025, from January 28 to 29, 2025, in San Francisco (Booth No. 6202).

The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS) marks a major leap forward in strengthening Europe’s semiconductor manufacturing ca-pabilities and chiplet innovation as part of the EU Chips Act. By provid-ing large industry players, SMEs, and start-ups with a facilitated access to cutting-edge technology, the APECS pilot line will establish a strong foundation for resilient and robust European semiconductor supply chains. Within APECS, the institutes collaborating in the Research Fab Microelectronics Germany (FMD) will work closely with European partners, to make a significant contribution to the European Union´s goals of increasing technological resilience, strengthening cross-border collaboration and enhancing its global competitiveness in semiconduc-tor technologies. APECS is co-funded by the Chips Joint Undertaking and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, Spain, through the “Chips for Europe” ini-tiative. The overall funding for APECS amounts to € 730 million over 4.5 years.