Press Releases

Fraunhofer IPMS develops photonic microsystems that modulate light using small, controllable mirrors to create unique images and structures. These so-called spatial light modulators (SLM) are micromirror arrays with up to several million mirrors on a semiconductor chip. They have applications in semiconductor manufacturing, microscopy and holography, and have brought the Institute to the forefront of international research in this field.

The accessibility of RISC-V has started a revolution and, thanks to its open architecture, allows developers to design processors tailored to specific requirements. The Fraunhofer IPMS also offers a processor IP based on the RISC V instruction set architecture. The institute has extensive RISC-V expertise, which is used in research projects and is actively developed.

• New hub will provide state-of-the-art metrology systems to accelerate semiconductor research and enhance development projects with chipmakers and ecosystem partners across Europe, particularly in ICAPS* market segments • Collaboration to accelerate learning, develop novel methods and prove new metrology equipment, methods, algorithms and software

The vehicles of the future will be automated and networked to drive autonomously in road traffic and to relieve the driver. This requires new vehicle architectures and high-performance components. The Fraunhofer IPMS is working on various research projects to create the necessary conditions.

Fraunhofer Institute for Photonic Microsystems IPMS uses optical microsystems to enable fast and high-resolution light control. By using small, movable mirrors, the institute's photonic systems can modulate light to create unique images and structures. The institute's researchers are implementing 1-axis- and 2-axis tilting mirrors as well as piston mirrors. The mirrors are monolithically integrated on so-called CMOS backplanes.

The potential of micro scanners in medical technology is immense. Their small size, low weight and high energy efficiency make them ideal for mobile use. More than 200 different micro scanner designs have been developed at Fraunhofer IPMS to meet customer-specific requirements. The range of services covers the entire value chain, from design and prototype development to pilot production in its own clean room on 8” wafer. Fraunhofer IPMS is continuously expanding the application range of scanner mirror technology with novel and patented design solutions and technology modules as well as the integration of artificial intelligence.

In-ear headphones, which are inserted wirelessly into the ear canal, could replace smartphones in the future. A team of researchers from the Fraunhofer Institute for Photonic Microsystems IPMS and Bosch Sensortec GmbH laid the foundation for this with a novel technology for the integrated micro loudspeakers — and received the Joseph von Fraunhofer Prize for it.

Developing pioneering technology solutions and bringing them into application - that is the goal of Fraunhofer Institute for Photonic Microsystems IPMS. At this year's SENSOR+TEST trade fair in Nuremberg, the institute will present its latest developments in optical, chemical and ultrasonic sensor technology.

The Technical University of Dresden and Fraunhofer Institute for Photonic Microsystems IPMS have reached concrete agreements on scientific cooperation with several universities in Taipei and Hsinchu in Taiwan in the presence of Saxony's Science Minister Sebastian Gemkow.

Despite in scientific research in multiple technologies, European industry faces challenges in translating quantum technology innovation into robust and scalable hardware processes and products. Project Qu-Pilot will change this by leveraging the existing piloting infrastructure predominantly distributed across the European research and technology organizations (RTOs). The end goal is to accelerate the time-to-market of European industrial innovation in quantum technology and help establishing a trusted supply chain. Fraunhofer IPMS contributes its expertise in state-of-the-art, industry-compatible CMOS semiconductor fabrication in 300 mm wafer standard.