300 mm CMOS Cleanroom

Process and product development for nanoelectronics

With the Center Nanoelectronic Technologies (CNT), Fraunhofer IPMS conducts applied research on 300 mm wafers for microchip producers, suppliers, equipment manufacturers and R&D partners.

For processing customer orders, 2700 m² of clean room space of class 6 and 3 (according to ISO 14644-1) as well as laboratory space for more than 80 processing and analytical tools are available. The equipment park includes deposition and etching systems as well as inspection and analysis equipment for determining defects and measuring layer properties.

In the area of FEoL and BEoL we offer the following technology developments and services on Ultra Large Scale Integration level (ULSI):

Please select:

Atomic Layer Deposition (ALD)

Nanopatterning / E-Beam Lithography

Chemical Mechanical Polishing (CMP)

Wafer Metallization

Wafer Cleaning

Wafer Services

Analytical Services & Metrology

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Fraunhofer IPMS - Cleanroom Tour