Fraunhofer Institute for Photonic Microsystems
Fraunhofer Institute for Photonic Microsystems
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  • About us
  • Media Hub
  • Events
  • Career
  • Contact
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  • About us
  • Applications
    [X] Applications
    • Evaluation Kits
      • CMUT Evaluation Kit
      • Diffractive MEMS Kit: Tilt Micro-Mirror Array
      • ISFET Evaluation Kit
      • LiFi-HotSpot Evaluation Kit
      • LiFi-GigaDock Evaluation Kit
      • MEMS Scanner Evaluation Kits
      • Microdisplays and Sensors Evaluation Kits
        • 720p OLED-Microdisplay Evaluation-Kit
        • Bidirectional OLED Microdisplays Evaluation Kit
        • High-resolution WUXGA OLED microdisplays Evaluation-Kit
        • Organic Photodiodes Evaluation Kit
        • Ultra-low power OLED Microdisplays Evaluation-Kit
        • Universal Optical Sensor Platform Evaluation Kit
      • RISC-V Prozessor IP Core Evaluation Kit
      • Time Sensitive Networking Evaluation Kit
    • Bio and Health
      • Diagnostics and Sensors
      • Medical Imaging
    • Green and Sustainable Microelectronics
      • Clean Technologies
        • Climate Impacting Gases and Substances
        • Environmentally compatible slurries
        • Environmentally friendly cleaning solvents for lithography
        • Reduction of PFAS in microelectronics
        • Substitution of NMP
        • GENESIS: Generate in Europe a Sustainable Industry for Semiconductors
      • Devices
        • Energy-saving chips for digital, analog and RF
        • Hyperspectral imaging inspection tool for efficient semiconductor production
    • Mobility
      • Automotive
      • Space
    • Smart industrial solutions
      • Industrial Solutions for Production
      • Industrial Solutions for Processes
  • Components and Systems
    [X] Components and Systems
    • Sensors
      • Electrochemical Sensors
        • Ion-sensitive field-effect transistors (ISFET)
        • Organic Field-Effect Transistors (OFET) and Organic Electrochemical Transistors (OECT)
        • Characterization of Materials
      • Optical Sensors
        • MEMS vectorscanner mirrors for LiDAR
        • Bidirectional OLED Microdisplays
        • MEMS based Spectroscopy Systems
        • Optical Gap
        • Organic Photodiodes
        • Photodiodes
        • Pyrosensors
        • Universal Optical Sensor Platform
      • Spectroscopy Systems and Components
        • Ion Mobility Spectrometer (IMS)
        • Compact grating spectrometer
        • Quantum cascade lasers
        • FT-IR Scan-Engines
      • Ultrasonic Sensors
        • Capacitive Micromachined Ultrasonic Transducer (CMUT)
        • Lateral Micromechanical Ultrasonic Transducer (L-CMUT)
        • Piezoelectric Micromachined Ultrasonic Transducers (PMUT)
    • Computing
      • Integrated Data Memory
        • Magnetoresistive RAM (MRAM)
        • Ferroelectric Memories
        • Resistive Random Access Memory (RRAM)
      • Energy Storage
        • Silicon Capacitors
        • Integrated Micro Batteries
      • 300 mm Technology Modules & Test Chips
        • Nanopatterning / E-Beam Lithography
        • Metallization
      • RF Characterization
    • Data Communication
      • Li-Fi Optical Data Transmission
        • Li-Fi-GigaDock
        • Li-Fi-HotSpot
      • IP-Cores
        • Digital IP Core Services
        • Digital IP Core Modules
        • Analog and Mixed Signal IP Core Modules
        • Automotive Network IP Core Designs
      • Quantum Communication
    • Integrated Photonics
      • Liquid Crystal Waveguide
      • MEMS Photonics (MEMS-on-PIC)
      • Biosynth - Modular high-throughput microplatform for future synthetic biology mass data storage.
      • Photonic Biosensors
      • Tunable Microlenses
    • Actuators
      • Mechanical Actuators
        • Nanoscopic Electrostatic Drive – electrostatic MEMS bending transducer
        • Energy Harvesting
        • Micromachined Ultrasonic Transducer
        • MEMS based Micropositioning Platforms
      • Optical Actuators
        • MEMS Scanners and Scan Engines
        • Spatial Light Modulators
    • Microdisplays
      • OLED Microdisplay Cleanroom
      • Secure AR service platform for industrial manufacturing
      • Universal lens for augmented reality eyewear
  • Cleanrooms
    [X] Cleanrooms
    • 200 mm MEMS Cleanroom
      • Cleanroom Infrastructure
      • MEMS Processes
      • MEMS Devices
      • Characterization and Test
      • Back End and Packaging
      • IC Design
      • OLED Microdisplay Cleanroom
    • 300 mm CMOS Cleanroom
      • Nanopatterning / E-Beam Lithography
      • Atomic Layer Deposition (ALD)
      • Chemical Mechanical Planarization (CMP)
      • Wafer Metallization
      • Wafer Cleaning
      • 300 mm Wafer Services
    • Analytics and Characterization
      • Analytics and Metrology
      • RF Characterization
    • APECS-Pilotlinie
      • Design Flows & System Design
      • Heterointegration Into Quasi-Monolithic Integration
      • Chiplet Integration (2.5D and 3D)
      • Analytics and Metrology / Characterization, Testing, and Reliability
      • Demos & Application Solutions
  • Research areas
    [X] Research areas
    • Neuromorphic Computing
      • 3DFerroKI - Hardware-based AI with 3-dimensional ferroelectric memories
      • HyDRA - Hybrid AI accelerators for neuromorphic computing
      • FeEdge - Innovative compute-in-memory modules for energy-efficient edge AI
      • FerroNEXT - Ferroelectric Neuromorphic Extended Testing
      • FerroSAFE - Field-induced crystallization for robust safety applications
      • PREVAIL - Technology platform for neuromorphic chips
      • Smart IR - AI-based infrared sensors
      • VITFOX - Vision transformers with ferroelectric oxides
    • Quantum Communication
      • CBQD - Chip-based quantum random device
      • MiQuE - Compact modules for mobile, free-beam quantum communication
      • Quant-ID - Quantum Secure Identities for a Digital Future
      • QuINSiDa - Quantum-based infrastructure networks for safety-critical wireless data communication
      • QuNET & MOBIXHAP - Mobile Nodes for Quantum Communication
      • QuNET & FuNK - Compact optical communication systems for quantum-safe information exchange between authorities
      • SEQUIN - Side-channel resistant module for fiber-optic quantum key distribution
    • Quantum Computing
      • ARCTIC - Scalable cryogenic control technology for quantum processors
      • PhoQuant - Photonic Quantum Computer
      • QLSI - Quantum Large-Scale Integration with Silicon
      • QSolid - Quantum computer in the solid state
      • QUASAR - semiconductor quantum processor with shuttling-based scalable architecture
      • Qu-Pilot - Pilot production capabilities for quantum technologies
      • SMAQ - Scalable Optical Modulators for Atomic Quantum Computers
      • TO.QI - Semiconductor technology modules for quantum computing, AI and Internet-of-Things
    • Trusted Electronics
      • InSeKT - Development of intelligent sensor-edge technologies
      • Silhouette - Silicon Photonics for trusted electronic components
      • TRAICT II – Trusted resource aware ICT
      • TrEKISS - Trusted Edge AI for Multi-sensor systems
      • VE4 - Trusted fault management of energy networks
      • Velektronik - Platform for trusted electronics
      • T4T - Distributed manufacturing for innovative and trusted electronics
  • Media Hub
    [X] Media Hub
    • Press Releases
      • Archive
      • Year 2020
        • Optical microsystems
        • X-ray photoelectron spectrometer at Fraunhofer IPMS
        • Real-time communication for automobiles
        • Covid-19 Statement
        • Micro loudspeaker made from silicon
        • NED audio technology for the market
        • Fraunhofer IPMS presents communication solutions for modern production
        • Fraunhofer IPMS develops IP designs for data control
        • Fraunhofer IPMS develops TSN Switch IP Core
        • M3 Infekt - Decentralized monitoring of COVID-19 patients
      • Year 2019
        • Press Release 2019-02-07
        • Press Release 2019-02-12
        • Press Release 2019-03-13
        • Press Release 2019-03-14
        • Press Release 2019-03-21
        • Press Release 2019-03-28
        • Press Release 2019-04-02
        • Gesture Recognition Using Ultrasound
        • Machine Perception - Scanning Eye Providing Robot Sight
        • Top marks for plastic bottle recycling system
        • Low-power Chips for AI Applications
        • More safety for driver assistance systems
        • Membrane-free MEMS Loudspeakers in Nature Microsystems and Nanoengineering scientific journal
        • Wireless and battery-free RFID sensor for switchgears
        • LiDAR technology for autonomous driving
        • Investments for Beyond-Moore process development and evaluation on 300 mm wafers
        • Wireless real-time communication via light - Wireless TSN via Li-Fi
        • Energy-efficient AI system
      • Year 2018
      • Year 2017
      • Year 2016
      • Year 2015
        • Press Release 2015-04-17
      • Year 2014
      • Year 2013
      • Year 2012
      • Year 2011
      • Year 2010
      • Year 2009
      • Year 2008
      • Year 2007
      • Year 2021
        • TSN IP core designs with low latency for automotive on-board networks
        • Fraunhofer IPMS is part of the European project ASCENT+
        • Thinking chips: Advanced materials and hardware for next generation computing
        • Scalable silicon qubits for quantum computers
        • Sensor platform for IoT and edge computing solutions
        • Trusted Electronics (Project Velektronik)
        • Energy-efficient sensor nodes from Fraunhofer
        • Ultrasonic measurement technology of the future
        • Towards a quantum processor "made in Germany"
        • Ultrasound sensor platform for SMEs
        • Reinforcement of the Institute Management at Fraunhofer IPMS
        • Project Silhouette launched
        • Terahertz technologies for visionary innovations
        • RISC-V Functional Safety Processor IP Core introduced by Fraunhofer IPMS and CAST
        • Innovative modeling approach for micro loudspeakers
        • Fraunhofer IPMS RISC-V processor core for functional safety
        • Stable European industry-scale fabrication value chains for solid-state-based quantum computer developmen
        • International Conference on Design and Technology in the IC Industry
        • Industrial automation and communication of the future
        • Zepowel: Das Internet der Dinge wird grüner
        • Fraunhofer IPMS presents a scalable TSN multiport switch at the TSN/A conference
        • Innovative Forschung soll Unternehmen in dünn besiedelten Regionen unterstützen
        • Noise-indicating lamp
        • Fraunhofer IPMS presents new technologies at the MST Congress
        • Innovative technologies for the industry
      • Year 2022
        • Risc-V-IP-Core-EMSA5-Lauterbach
        • Near infrared spectral analysis for mobile applications
        • Fraunhofer IPMS develops CANsec Controller IP-Core CAN-SEC
        • Fraunhofer IPMS develops demonstrator with gesture control for OZEANEUM in Stralsund
        • Miniaturized components of Fraunhofer IPMS
        • Trustworthy electronics "Made in Germany"
        • Kick-off for the "Green ICT @ FMD" competence center
        • Miniaturization saves energy in industrial automation
        • Modular high-throughput micro-platform for mass data storage of the future
        • Li-Fi GigaDock® Transceiver on ISS space station
        • Fraunhofer IPMS presents 200 and 300 mm technologies
        • Sensor and actuator-based signal preprocessing using AI-based methods
        • Photonics - Shining technology of the future
        • Research Fab for quantum and neuromorphic computing
        • Push-pull principle for loudspeaker concept
      • Year 2023
      • Year 2024
      • Year 2025
    • Annual Reports
    • Newsletter Subscription
    • Scientific publications
    • Whitepaper
    • Fraunhofer IPMS Webinars
  • Events
    [X] Events
    • 2016
      • ECOC 2016
      • Electronica
      • FachPack
      • Lange Nacht der Wissenschaften
      • Optatec
      • Semicon Europa
      • Semicon West
      • Sensor & Test
      • Sensors Expo
      • sps ipc drives
      • Vision
      • CNT - Industry Partner Day
    • Year 2017
      • Jahrestagung der DGaO
      • Embedded World
      • European MEMS Sensors Summit
      • Lange Nacht der Wissenschaften
      • Laser
      • LogiMAT
      • MST-Kongress
      • OFC
      • Photonics West
      • Photonix
      • RFID tomorrow
      • Sensor & Test
      • Sensors Expo
      • Smart Systems Integration
      • Semicon West
      • Semicon Europe
      • sps ipc drives
      • Fraunhofer IPMS - Industry Partner Day
      • Workshop LiFi
    • Year 2018
      • Analytica
      • Electronica
      • Embedded World
      • European MEMS Sensors Summit
      • Global LiFi Congress
      • Hannover Fair
      • IDTechEX
      • Lange Nacht der Wissenschaften
      • LogiMAT
      • OFC
      • Optatec
      • Photonics West
      • Photonik-Tage Berlin-Brandenburg
      • Photonix
      • RFID Journal live
      • RFID tomorrow
      • RFID '18
      • Semicon West
      • Sensor & Test
      • Sensors Expo
      • sps ipc drives
      • Smart Systems Integration
      • Smart SysTech
      • Carbon Nanotubes Workshop @DATE 2018
      • Technologietag Angewandte Sensorik
      • Vision
    • Year 2019
      • Fraunhofer IPMS - Industry Partner Day
      • LiFi '19
      • RFID '19
      • Automate
      • Embedded World
      • Hannover Fair
      • LogiMAT
      • OASIS
      • OFC
      • Photonics West
      • RFID Journal live
      • Smart Systems Integration
      • Industry Partner Day
      • Lange Nacht der Wissenschaften
      • Laser
      • Sensor & Test
      • Semicon West
      • European MEMS Sensors Summit
      • Automotive LIDAR
      • RFID tomorrow
      • MST-Kongress
      • Miroctech Innovation Summit
      • Productronica
      • sps ipc drives
      • Photonix
      • TSN/A Conference
      • GTC
    • Year 2020
      • Photonix West
      • LiFi-Workshops 2020
      • Sensor und Test
      • Lange Nacht der Wissenschaften Dresden
      • Embedded World 2020
      • Hannovermesse
      • Automotive Ethernet Congress
      • MEMS & Imaging Sensors Summit
      • Medical Wearables
      • Industry Partner Day 2020
      • Corona
      • Semicon West
      • TSN/A Conference
      • electronica
      • Semicon Europe
      • COMPAMED
      • Optatec
      • Photonix - cancelled
      • SPS
      • Webinar MEOS
      • Digitaltag 2020
      • Vehicle Environment Detection
      • INDUSTRIAL production + handling
      • GTC
      • Bordnetz Kongress
      • Fraunhofer Solution Days
      • IEDM Conference 2020
    • Year 2021
      • Technology Unites
      • Automotive Ethernet Congress
      • SPIE Photonics West
      • SPIE Photonics West
      • Semicon Europa
      • Photonix
      • MicroFab Summit
      • International Conference on IC Design and Technology 2021
      • Medical Wearables
      • all about automation
      • TSN/A Conference
      • SPIE Photonics West
      • Spatial Light Modulators – Status and Potential for Holography
      • Webinar: Material development for MRAM and FRAM stacks
    • Year 2022
      • Embedded World
      • SPIE Photonics West
      • Sensor + Test
      • OFC
      • analytica
      • MEMS Manufacturing
      • Laser - World of Photonics
      • Dresden Science Night
      • All About Automation
      • World of QUANTUM
      • Semicon Europa
      • MEDICA
      • Photonix
      • electronica
      • MEMS & Imaging Sensors Summit 2022
    • Year 2023
      • SPIE Photonics West
      • OFC 2023
      • embedded World 2023
      • Sensor + Test
      • Laser - World of Photonics
      • MikroSystemTechnik Kongress
      • Semicon Europa
      • MEDICA
      • Night of the Sciences Dresden
      • Photonix
    • Year 2024
      • SPIE Photonics West
      • analytica 2024
      • Sensor + Test 2024
      • Photonix Japan 2024
      • Semicon West 2024
      • iCCC 2024
      • Semicon Europa 2024
      • Night of the Sciences Dresden
      • SID - Display Week
      • 24th International Meeting on Information Display (IMID 2024)
      • SID-ME-Chapter Online-Meeting
      • W3+ Fair Jena
      • electronica 2024
      • Future Forces
      • International Display Workshop
      • SID Mid-Europe Chapter (SID-MEC) Autumn Online Talk
    • Year 2025
      • SPIE Photonics West
      • Sensor + Test 2025
      • SID - Display Week
      • SPIE AR/VR/MR
      • SID Mid-Europe Chapter Conference
      • Semicon West 2025
      • Photonix Japan 2025
      • Semicon Europe 2025
      • Laser - World of Photonics
      • Anwenderworkshop Projekt BIOSYNTH 2025
      • Dresden Science Night 2025
      • Silicon Saxony Day 2025
      • SynBioBeta - The Global Synthetic Biology Conference
      • SID-MEC Spring 2025 Online Talk "Holography in Displays"
      • MikroSystemTechnik Kongress
      • Green ICT Camp
      • electronica India
      • SID-MEC Fall 2025 Online Meeting "Quantum Dot Materials and Processing for Displays"
    • Year 2026
      • iCampµs-Cottbus Conference iCCC2026
      • SPIE AR/VR/MR
      • International Conference on IC Design and Technology 2026
  • Career
    [X] Career
    • PhD students
    • Training & Dual Studies
    • Graduates and professionals
    • Students
    • FAQs
    • Many good reasons that speak for Fraunhofer IPMS
    • TALENTA - A career booster for women at Fraunhofer
  • Contact
    [X] Contact
    • Ombudspersons
  • More
    • About us
    • Applications
      [X] Applications
      • Evaluation Kits
        • CMUT Evaluation Kit
        • Diffractive MEMS Kit: Tilt Micro-Mirror Array
        • ISFET Evaluation Kit
        • LiFi-HotSpot Evaluation Kit
        • LiFi-GigaDock Evaluation Kit
        • MEMS Scanner Evaluation Kits
        • Microdisplays and Sensors Evaluation Kits
          • 720p OLED-Microdisplay Evaluation-Kit
          • Bidirectional OLED Microdisplays Evaluation Kit
          • High-resolution WUXGA OLED microdisplays Evaluation-Kit
          • Organic Photodiodes Evaluation Kit
          • Ultra-low power OLED Microdisplays Evaluation-Kit
          • Universal Optical Sensor Platform Evaluation Kit
        • RISC-V Prozessor IP Core Evaluation Kit
        • Time Sensitive Networking Evaluation Kit
      • Bio and Health
        • Diagnostics and Sensors
        • Medical Imaging
      • Green and Sustainable Microelectronics
        • Clean Technologies
          • Climate Impacting Gases and Substances
          • Environmentally compatible slurries
          • Environmentally friendly cleaning solvents for lithography
          • Reduction of PFAS in microelectronics
          • Substitution of NMP
          • GENESIS: Generate in Europe a Sustainable Industry for Semiconductors
        • Devices
          • Energy-saving chips for digital, analog and RF
          • Hyperspectral imaging inspection tool for efficient semiconductor production
      • Mobility
        • Automotive
        • Space
      • Smart industrial solutions
        • Industrial Solutions for Production
        • Industrial Solutions for Processes
    • Components and Systems
      [X] Components and Systems
      • Sensors
        • Electrochemical Sensors
          • Ion-sensitive field-effect transistors (ISFET)
          • Organic Field-Effect Transistors (OFET) and Organic Electrochemical Transistors (OECT)
          • Characterization of Materials
        • Optical Sensors
          • MEMS vectorscanner mirrors for LiDAR
          • Bidirectional OLED Microdisplays
          • MEMS based Spectroscopy Systems
          • Optical Gap
          • Organic Photodiodes
          • Photodiodes
          • Pyrosensors
          • Universal Optical Sensor Platform
        • Spectroscopy Systems and Components
          • Ion Mobility Spectrometer (IMS)
          • Compact grating spectrometer
          • Quantum cascade lasers
          • FT-IR Scan-Engines
        • Ultrasonic Sensors
          • Capacitive Micromachined Ultrasonic Transducer (CMUT)
          • Lateral Micromechanical Ultrasonic Transducer (L-CMUT)
          • Piezoelectric Micromachined Ultrasonic Transducers (PMUT)
      • Computing
        • Integrated Data Memory
          • Magnetoresistive RAM (MRAM)
          • Ferroelectric Memories
          • Resistive Random Access Memory (RRAM)
        • Energy Storage
          • Silicon Capacitors
          • Integrated Micro Batteries
        • 300 mm Technology Modules & Test Chips
          • Nanopatterning / E-Beam Lithography
          • Metallization
        • RF Characterization
      • Data Communication
        • Li-Fi Optical Data Transmission
          • Li-Fi-GigaDock
          • Li-Fi-HotSpot
        • IP-Cores
          • Digital IP Core Services
          • Digital IP Core Modules
          • Analog and Mixed Signal IP Core Modules
          • Automotive Network IP Core Designs
        • Quantum Communication
      • Integrated Photonics
        • Liquid Crystal Waveguide
        • MEMS Photonics (MEMS-on-PIC)
        • Biosynth - Modular high-throughput microplatform for future synthetic biology mass data storage.
        • Photonic Biosensors
        • Tunable Microlenses
      • Actuators
        • Mechanical Actuators
          • Nanoscopic Electrostatic Drive – electrostatic MEMS bending transducer
          • Energy Harvesting
          • Micromachined Ultrasonic Transducer
          • MEMS based Micropositioning Platforms
        • Optical Actuators
          • MEMS Scanners and Scan Engines
          • Spatial Light Modulators
      • Microdisplays
        • OLED Microdisplay Cleanroom
        • Secure AR service platform for industrial manufacturing
        • Universal lens for augmented reality eyewear
    • Cleanrooms
      [X] Cleanrooms
      • 200 mm MEMS Cleanroom
        • Cleanroom Infrastructure
        • MEMS Processes
        • MEMS Devices
        • Characterization and Test
        • Back End and Packaging
        • IC Design
        • OLED Microdisplay Cleanroom
      • 300 mm CMOS Cleanroom
        • Nanopatterning / E-Beam Lithography
        • Atomic Layer Deposition (ALD)
        • Chemical Mechanical Planarization (CMP)
        • Wafer Metallization
        • Wafer Cleaning
        • 300 mm Wafer Services
      • Analytics and Characterization
        • Analytics and Metrology
        • RF Characterization
      • APECS-Pilotlinie
        • Design Flows & System Design
        • Heterointegration Into Quasi-Monolithic Integration
        • Chiplet Integration (2.5D and 3D)
        • Analytics and Metrology / Characterization, Testing, and Reliability
        • Demos & Application Solutions
    • Research areas
      [X] Research areas
      • Neuromorphic Computing
        • 3DFerroKI - Hardware-based AI with 3-dimensional ferroelectric memories
        • HyDRA - Hybrid AI accelerators for neuromorphic computing
        • FeEdge - Innovative compute-in-memory modules for energy-efficient edge AI
        • FerroNEXT - Ferroelectric Neuromorphic Extended Testing
        • FerroSAFE - Field-induced crystallization for robust safety applications
        • PREVAIL - Technology platform for neuromorphic chips
        • Smart IR - AI-based infrared sensors
        • VITFOX - Vision transformers with ferroelectric oxides
      • Quantum Communication
        • CBQD - Chip-based quantum random device
        • MiQuE - Compact modules for mobile, free-beam quantum communication
        • Quant-ID - Quantum Secure Identities for a Digital Future
        • QuINSiDa - Quantum-based infrastructure networks for safety-critical wireless data communication
        • QuNET & MOBIXHAP - Mobile Nodes for Quantum Communication
        • QuNET & FuNK - Compact optical communication systems for quantum-safe information exchange between authorities
        • SEQUIN - Side-channel resistant module for fiber-optic quantum key distribution
      • Quantum Computing
        • ARCTIC - Scalable cryogenic control technology for quantum processors
        • PhoQuant - Photonic Quantum Computer
        • QLSI - Quantum Large-Scale Integration with Silicon
        • QSolid - Quantum computer in the solid state
        • QUASAR - semiconductor quantum processor with shuttling-based scalable architecture
        • Qu-Pilot - Pilot production capabilities for quantum technologies
        • SMAQ - Scalable Optical Modulators for Atomic Quantum Computers
        • TO.QI - Semiconductor technology modules for quantum computing, AI and Internet-of-Things
      • Trusted Electronics
        • InSeKT - Development of intelligent sensor-edge technologies
        • Silhouette - Silicon Photonics for trusted electronic components
        • TRAICT II – Trusted resource aware ICT
        • TrEKISS - Trusted Edge AI for Multi-sensor systems
        • VE4 - Trusted fault management of energy networks
        • Velektronik - Platform for trusted electronics
        • T4T - Distributed manufacturing for innovative and trusted electronics
    • Media Hub
      [X] Media Hub
      • Press Releases
        • Archive
        • Year 2020
          • Optical microsystems
          • X-ray photoelectron spectrometer at Fraunhofer IPMS
          • Real-time communication for automobiles
          • Covid-19 Statement
          • Micro loudspeaker made from silicon
          • NED audio technology for the market
          • Fraunhofer IPMS presents communication solutions for modern production
          • Fraunhofer IPMS develops IP designs for data control
          • Fraunhofer IPMS develops TSN Switch IP Core
          • M3 Infekt - Decentralized monitoring of COVID-19 patients
        • Year 2019
          • Press Release 2019-02-07
          • Press Release 2019-02-12
          • Press Release 2019-03-13
          • Press Release 2019-03-14
          • Press Release 2019-03-21
          • Press Release 2019-03-28
          • Press Release 2019-04-02
          • Gesture Recognition Using Ultrasound
          • Machine Perception - Scanning Eye Providing Robot Sight
          • Top marks for plastic bottle recycling system
          • Low-power Chips for AI Applications
          • More safety for driver assistance systems
          • Membrane-free MEMS Loudspeakers in Nature Microsystems and Nanoengineering scientific journal
          • Wireless and battery-free RFID sensor for switchgears
          • LiDAR technology for autonomous driving
          • Investments for Beyond-Moore process development and evaluation on 300 mm wafers
          • Wireless real-time communication via light - Wireless TSN via Li-Fi
          • Energy-efficient AI system
        • Year 2018
        • Year 2017
        • Year 2016
        • Year 2015
          • Press Release 2015-04-17
        • Year 2014
        • Year 2013
        • Year 2012
        • Year 2011
        • Year 2010
        • Year 2009
        • Year 2008
        • Year 2007
        • Year 2021
          • TSN IP core designs with low latency for automotive on-board networks
          • Fraunhofer IPMS is part of the European project ASCENT+
          • Thinking chips: Advanced materials and hardware for next generation computing
          • Scalable silicon qubits for quantum computers
          • Sensor platform for IoT and edge computing solutions
          • Trusted Electronics (Project Velektronik)
          • Energy-efficient sensor nodes from Fraunhofer
          • Ultrasonic measurement technology of the future
          • Towards a quantum processor "made in Germany"
          • Ultrasound sensor platform for SMEs
          • Reinforcement of the Institute Management at Fraunhofer IPMS
          • Project Silhouette launched
          • Terahertz technologies for visionary innovations
          • RISC-V Functional Safety Processor IP Core introduced by Fraunhofer IPMS and CAST
          • Innovative modeling approach for micro loudspeakers
          • Fraunhofer IPMS RISC-V processor core for functional safety
          • Stable European industry-scale fabrication value chains for solid-state-based quantum computer developmen
          • International Conference on Design and Technology in the IC Industry
          • Industrial automation and communication of the future
          • Zepowel: Das Internet der Dinge wird grüner
          • Fraunhofer IPMS presents a scalable TSN multiport switch at the TSN/A conference
          • Innovative Forschung soll Unternehmen in dünn besiedelten Regionen unterstützen
          • Noise-indicating lamp
          • Fraunhofer IPMS presents new technologies at the MST Congress
          • Innovative technologies for the industry
        • Year 2022
          • Risc-V-IP-Core-EMSA5-Lauterbach
          • Near infrared spectral analysis for mobile applications
          • Fraunhofer IPMS develops CANsec Controller IP-Core CAN-SEC
          • Fraunhofer IPMS develops demonstrator with gesture control for OZEANEUM in Stralsund
          • Miniaturized components of Fraunhofer IPMS
          • Trustworthy electronics "Made in Germany"
          • Kick-off for the "Green ICT @ FMD" competence center
          • Miniaturization saves energy in industrial automation
          • Modular high-throughput micro-platform for mass data storage of the future
          • Li-Fi GigaDock® Transceiver on ISS space station
          • Fraunhofer IPMS presents 200 and 300 mm technologies
          • Sensor and actuator-based signal preprocessing using AI-based methods
          • Photonics - Shining technology of the future
          • Research Fab for quantum and neuromorphic computing
          • Push-pull principle for loudspeaker concept
        • Year 2023
        • Year 2024
        • Year 2025
      • Annual Reports
      • Newsletter Subscription
      • Scientific publications
      • Whitepaper
      • Fraunhofer IPMS Webinars
    • Events
      [X] Events
      • 2016
        • ECOC 2016
        • Electronica
        • FachPack
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Online in Internet; URL: https://www.ipms.fraunhofer.de/en/events/2018/logimat.html

Date: 25.7.2025 17:02