Project: DE-TW-MicroView – High-resolution, transparent microdisplays for augmented reality and wearable devices

Motivation

Microelectronics is a key enabling technology for Europe’s digital transformation and technological sovereignty. In order to sustainably strengthen Germany’s innovation capacity and competitiveness, the Federal Ministry of Research, Technology and Space (BMFTR) is expanding research cooperation with Taiwan – a globally leading hub for semiconductor technologies and chip manufacturing.

The joint research project promotes scientific exchange between German research institutions and Taiwanese partners, unlocks new research potential in innovative display and semiconductor technologies, and supports the training of highly qualified specialists in the field of microelectronics and chip design.

Objectives and Approach

The goal of the project is the development of a next-generation transparent augmented reality (AR) display. The display aims to achieve a resolution of more than 10,000 dpi with a light transmittance of over 65%, thereby setting new standards for near-to-eye applications.

To achieve this, three innovative technologies are combined:

• Semi-transparent CMOS circuits
• High-resolution micro-LEDs
• Metalens arrays for precise light steering

A key development step is the reduction of pixel size from currently 3.5 µm to 2.5 µm. The developed components will then be integrated into a transparent near-to-eye display module. The project concludes with the realization of a joint AR demonstrator that validates the technical feasibility of the concept under real-world conditions.

Innovations and Outlook

The project strengthens German–Taiwanese cooperation in microelectronics and contributes to advancing competencies in chip design, micro-LED technology, and advanced display systems.

Research on transparent micro-LED displays, innovative CMOS backplanes, and the required integration technologies lays the foundation for future AR glasses and other augmented reality applications. At the same time, the project promotes knowledge transfer, the training of skilled professionals, and the innovation capacity of Germany as a research and technology location.

Project objective

The project develops a transparent augmented reality (AR) display with a resolution of over 10,000 dpi and a light transmittance of more than 65%. The goal is to establish the technological basis for high-performance, compact next-generation AR glasses.

Key technologies

The research focuses on semi-transparent CMOS circuits, high-resolution micro-LEDs, and innovative metalens arrays. By combining these approaches, a transparent near-to-eye display with high image quality and high optical transparency is realized.

Role of Fraunhofer IPMS

Fraunhofer IPMS contributes its expertise in microelectronics, CMOS technologies, microdisplay development, and advanced packaging and integration technologies to the consortium.

Why Germany collaborates with Taiwan

Taiwan is one of the world’s leading hubs for semiconductor research and chip manufacturing. The cooperation enables access to complementary expertise, strengthens joint research capabilities, and supports Europe’s technological sovereignty in microelectronics.

Advantages of transparent AR displays

Transparent AR displays allow users to perceive the real environment and digital information simultaneously. This makes them suitable for applications in industry, medicine, mobility, education, and entertainment.

Future applications

The developed technologies can be used in AR glasses for industrial assistance systems, medical visualization, maintenance and repair, navigation, and future consumer AR devices.

Contribution to microelectronics in Germany

The project strengthens research expertise in semiconductor technologies, supports the training of highly qualified specialists, and expands international research networks. It thereby contributes to the innovation capacity and competitiveness of Germany as a technology location.

Project partners

• National Taiwan University
• National Cheng Kung University
• Fraunhofer IPMS