NeAIxt - Next Generation of edge AI crossing technology fields

NeAIxt - Next Generation of edge AI crossing technology fields

Project duration: 09/2025- 08/2028

The NeAIxt project aims to strengthen Europe's independence and control over edge AI technologies. It focuses on developing and integrating novel storage solutions and creating powerful, secure microcontrollers with AI capabilities for various applications. The idea is to develop a trusted application for edge AI to strengthen Europe's innovation capacity.

The goal of the project

The NeAIxt project, with over 65 project partners, aims to strengthen Europe's role in the technological revolution in the field of edge AI. It seeks to promote Europe's independence and control over edge AI technologies, in particular through the development and integration of innovative storage solutions such as embedded non-volatile memory (eNVM). In addition, the project aims to develop powerful, secure microcontrollers with AI capabilities that have low power consumption and meet the requirements of modern systems. Monitored resource planning will help ensure that optimization and research can continue to be carried out in a resource-efficient manner in the future.

The next steps

The next steps in the NeAIxt project include the technical development and integration of advanced technologies for edge AI applications, including the further development of embedded non-volatile memory (eNVM) and microcontrollers. In addition, the creation and evaluation of demonstrators and the performance of benchmark tests are planned to validate the efficiency and security of the developed solutions. Upon completion of the project, the developed technologies will be transferred to commercial applications to consolidate Europe's position in the field of edge AI and contribute to the creation of a reliable and secure technological environment. 

Fraunhofer IPMS in the project

Fraunhofer IPMS plays a central role in the NeAIxt project and focuses in particular on the research and development of innovative microcontrollers (MCUs) and non-volatile memory solutions (eNVM) that are optimized for AI applications at the edge.

Fraunhofer IPMS's main objectives within the project are to explore new architectures and technologies that enable the integration of AI into various applications. This includes the development of microcontrollers that impress with their high energy efficiency and performance, thus meeting the requirements of modern applications. The institute's work includes improving existing technologies and researching new materials to ensure that the solutions developed are not only innovative but also sustainable and environmentally friendly.

Fraunhofer IPMS promotes close cooperation with companies, research institutions, and small and medium-sized enterprises (SMEs) to ensure that the technologies developed are practical and meet current market requirements. These collaborations are crucial for strengthening European competitiveness and ensuring technological independence.

Consortium

  • STMicroelectronics Crolles 2 SAS
  • STMicroelectronics Grenoble 2 SAS
  • STMicroelectronics Rousset SAS
  • Commissariat à l’Énergie Atomique et aux Énergies
  • Technext
  • Soitec SA
  • Thales DIS France SAS
  • Pfeiffer Vacuum
  • Unity Semiconductor
  • Université d’Aix Marseille
  • Institut Polytechnique de Grenoble
  • Université Grenoble Alpes
  • Institut Mikroelektronickych Aplikaci SRO
  • Ustav Teorie Informace a Automatizace AV CR VVI
  • Fraunhofer-Gesellschaft
  • Technische Universität Braunschweig
  • Technische Universität Darmstadt
  • X-FAB Dresden GmbH & Co. KG
  • X-FAB Global Services GmbH
  • Endiio Engineering GmbH
  • Knowtion GmbH
  • Emmtrix Technologies GmbH
  • Micro-Sensys GmbH
  • IMMS Institut für Mikroelektronik- und Mechatrode
  • Kungliga Tekniska Högskolan
  • Strikersoft AB
  • IRnova AB
  • Totalförsvarets Forskningsinstitut
  • Itä-Suomen Yliopisto
  • Teknologian Tutkimuskeskus VTT Oy
  • Haltian Oy
  • Thinglink Oy
  • Kovilta Oy
  • Picosun Oy
  • Danmarks Tekniske Universitet
  • Danfoss Power Electronics AS
  • GN Store Nord
  • ISD Lyseis Olokriroménon Systimátanononymos Etel
  • Think Silicon Research and Technology Single Memel
  • Aristotelio Panepistimio Thessalonikis
  • Geosystems Hellas IT kai Efarmogesgeopliroforia
  • Ethniko kai Kapodistriako Panepistimio Athinon
  • University of Piraeus Research Center
  • Universitat Autonoma de Barcelona
  • Universidad de Sevilla
  • Universiteit Twente
  • Locsense B.V.
  • Almende BV
  • Innatera Nanosystems BV
  • Sorama BV
  • Stichting IMEC Nederland
  • Technische Universiteit Delft
  • STMicroelectronics SRL
  • Interactive Fully Electrical Vehicles SRL
  • Applied Materials Italia SRL
  • Consorzio Nazionale Interuniversitario per la NA
  • Alma Mater Studiorum – Università di Bologna
  • Università degli Studi di Catania
  • Università degli Studi di Pavia
  • Marullo SPA
  • Ricca IT SRL
  • Instituto de Telecomunicações
  • Associação Fraunhofer Portugal Research
  • MEO – Serviços de Comunicações e Multimédia SA
  • Weebit Nano Ltd
  • Türkiye Bilimsel ve Teknolojik Araştırma Kurumu

Associated partners:

  • CSEM Centre Suisse d’Électronique et de Microtech
  • Klepsydra Technologies AG