IC Design

At Fraunhofer IPMS, the design of integrated circuits (ICs) is a core competence, built on many years of experience in analog, mixed-signal, and digital circuit design. This expertise enables us to provide fully customized solutions—from the initial concept to the final device—tailored to each application’s requirements.

Our work focuses on highly complex microelectronic devices, including microdisplays and optoelectronic sensors, following the “More-Than-Moore” approach: integrating additional functions beyond standard CMOS capabilities. To achieve this, we employ industry-standard design methodologies, including circuit simulation, layout design, and verification, and implement our designs using mixed analog/digital CMOS processes in collaboration with silicon foundries worldwide.

Fraunhofer IPMS offers unique capabilities in customizing standard CMOS processes and applying post-processing techniques, such as the deposition of organic light-emitting diodes (OLEDs) or photodiodes, directly in our 200 mm cleanroom facility. This enables the augmentation of CMOS wafers with optical and photonic components, providing enhanced functionality for high-resolution microdisplays and other optoelectronic devices.

After fabrication, circuits undergo rigorous wafer-level and component-level testing to verify functionality, followed by prototype creation. Transfer to pilot production is then carried out on a project-specific basis, ensuring seamless integration from concept to production-ready devices.

Our Offer

Fraunhofer IPMS provides state-of-the-art design of analog, digital, and mixed-signal circuits, with application-specific adaptation of standard CMOS processes. We support the full design workflow, from concept to pilot production, using industry-standard methodologies for circuit simulation, layout design, and verification.

Typical CMOS processes: 0.02 μm / 0.028 μm / 0.11 μm

Our services include:

• Conception and system design
• Circuit modeling and simulation
• Layout and verification
• Coordination of external CMOS wafer manufacturing, serving as the interface between customer and foundry
• Prototype fabrication and transfer to pilot production
• Testing, start-up, implementation, and lifetime investigation

We also offer a wide portfolio of silicon-proven IP cells, enabling fast, reliable, and application-specific microelectronic solutions.