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Fraunhofer Institute for Photonic Microsystems
Fraunhofer Institute for Photonic Microsystems
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Application Areas
Smart industrial solutions
Industrial Solutions for Logistics
Industrial Solutions for Production
Industrial Solutions for Processes
Medical and Health
Prevention and Therapy
Diagnostics and Sensors
Medical Imaging
Quality of Life
Mobility and Work
Sport and Health
Components & Systems
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Components & Systems
Sensors
Ultrasonic Sensors
Capacitive Micromachined Ultrasonic Transducer (CMUT)
NED-based Micromechanical Ultrasonic Transducer (NEDMUT)
Piezoelectric Micromachined Ultrasonic Transducers (PMUT)
Optical Sensors
MEMS based Spectroscopy Systems
Automotive LiDAR Technology
Optical Ring Resonator
Integrated Photonic Devices
Optical Gap
Pyrosensors
Photodiodes
Chemical Sensors
Detection of volatile organics using MEMS-based ion mobility spectrometers (DoSIs)
Resource-efficient electrochemical analysis (REAL)
Electrical Sensors
Data Communication
Li-Fi Optical Data Transmission
Li-Fi-GigaDock
Li-Fi-HotSpot
RFID Sensor Systems
IP-Core Design for FPGA and ASIC
Digital IP Core Modules
Analog and Mixed Signal IP Core Modules
FPGA and SoC Design Services
Automotive Network IP Core Designs
Computing
Memory Technology
Magnetoresistive RAM (MRAM)
Ferroelectric Field Effect Transistor (FeFET)
Ferroelectric RAM (FRAM)
Energy Storage
Silicon Capacitors
Integrated Micro Batteries
300 mm Technology Modules & Test Chips
Nanopatterning
Metallization
RF Characterization
Actuators
Mechanical Actuators
Nanoscopic Electrostatic Drive – electrostatic MEMS bending transducer
Energy Harvesting
Capacitive Micromachined Ultrasonic Transducer (CMUT)
Optical Actuators
MEMS-Scanner
Spatial Light Modulators
Tunable Microlenses
Liquid Crystal Waveguide
Services
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Services
MEMS Technologies Dresden
MEMS Capabilities
MEMS Cleanroom
MEMS Competencies
MEMS Offerings
300 mm Semiconductor Processes
Nanopatterning
Atomic Layer Deposition (ALD)
Chemical Mechanical Planarization (CMP)
Wafer Metallization
Wafer Cleaning
300 mm Wafer Services
Analytics & Metrology
Evaluation Kits
MEMS Scanner Evaluation Kit
CMUT Evaluation Kit
LiFi-HotSpot Evaluation Kit
LiFi-GigaDock Evaluation Kit
RFID Sensors Evaluation Kit
Time Sensitive Networking Evaluation Kit
RISC-V Prozessor IP Core Evaluation Kit
Research areas
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Research areas
Green ICT / Green IT
Environmentally friendly cleaning technologies in microchip production
Neuromorphic Computing
TEMPO - Technology and Hardware for Neuromorphic Computing
ANDANTE - Ai for New Devices And Technologies at the Edge
MEMION - Memristive Redox Transistors for Neuromorphic Computer Architectures
Trusted Electronics
Velektronik - Platform for trusted electronics
Silhouette - Silicon Photonics for trusted electronic components
Quantum Computing
QUASAR - semiconductor quantum processor with shuttling-based scalable architecture
QLSI - Quantum Large-Scale Integration with Silicon
HalQ - Semiconductor-based quantum computing
MATQu - Materials for Quantum Computing
Press & Media
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Press & Media
Press Releases
Archive
Year 2020
Optical microsystems
X-ray photoelectron spectrometer at Fraunhofer IPMS
Real-time communication for automobiles
Covid-19 Statement
Micro loudspeaker made from silicon
NED audio technology for the market
Fraunhofer IPMS presents communication solutions for modern production
Fraunhofer IPMS develops IP designs for data control
Fraunhofer IPMS develops TSN Switch IP Core
M3 Infekt - Decentralized monitoring of COVID-19 patients
Year 2019
Press Release 2019-02-07
Press Release 2019-02-12
Press Release 2019-03-13
Press Release 2019-03-14
Press Release 2019-03-21
Press Release 2019-03-28
Press Release 2019-04-02
Gesture Recognition Using Ultrasound
Machine Perception - Scanning Eye Providing Robot Sight
Top marks for plastic bottle recycling system
Low-power Chips for AI Applications
More safety for driver assistance systems
Membrane-free MEMS Loudspeakers in Nature Microsystems and Nanoengineering scientific journal
Wireless and battery-free RFID sensor for switchgears
LiDAR technology for autonomous driving
Investments for Beyond-Moore process development and evaluation on 300 mm wafers
Wireless real-time communication via light - Wireless TSN via Li-Fi
Energy-efficient AI system
Year 2018
Year 2017
Year 2016
Year 2015
Press Release 2015-04-17
Year 2014
Year 2013
Year 2012
Year 2011
Year 2010
Year 2009
Year 2008
Year 2007
Year 2021
TSN IP core designs with low latency for automotive on-board networks
Fraunhofer IPMS is part of the European project ASCENT+
Thinking chips: Advanced materials and hardware for next generation computing
Scalable silicon qubits for quantum computers
Sensor platform for IoT and edge computing solutions
Trusted Electronics (Project Velektronik)
Energy-efficient sensor nodes from Fraunhofer
Ultrasonic measurement technology of the future
Towards a quantum processor "made in Germany"
Ultrasound sensor platform for SMEs
Reinforcement of the Institute Management at Fraunhofer IPMS
Project Silhouette launched
Terahertz technologies for visionary innovations
RISC-V Functional Safety Processor IP Core introduced by Fraunhofer IPMS and CAST
Innovative modeling approach for micro loudspeakers
Fraunhofer IPMS RISC-V processor core for functional safety
Stable European industry-scale fabrication value chains for solid-state-based quantum computer developmen
International Conference on Design and Technology in the IC Industry
Industrial automation and communication of the future
Zepowel: Das Internet der Dinge wird grüner
Fraunhofer IPMS presents a scalable TSN multiport switch at the TSN/A conference
Innovative Forschung soll Unternehmen in dünn besiedelten Regionen unterstützen
Annual Reports
Newsletter Subscription
Scientific publications
Whitepaper
Fraunhofer IPMS Webinars
Events
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Events
2016
ECOC 2016
Electronica
FachPack
Lange Nacht der Wissenschaften
Optatec
Semicon Europa
Semicon West
Sensor & Test
Sensors Expo
sps ipc drives
Vision
CNT - Industry Partner Day
Year 2017
Jahrestagung der DGaO
Embedded World
European MEMS Sensors Summit
Lange Nacht der Wissenschaften
Laser
LogiMAT
MST-Kongress
OFC
Photonics West
Photonix
RFID tomorrow
Sensor & Test
Sensors Expo
Smart Systems Integration
Semicon West
Semicon Europe
sps ipc drives
Fraunhofer IPMS - Industry Partner Day
Workshop LiFi
Year 2018
Analytica
Electronica
Embedded World
European MEMS Sensors Summit
Global LiFi Congress
Hannover Fair
IDTechEX
Lange Nacht der Wissenschaften
LogiMAT
OFC
Optatec
Photonics West
Photonik-Tage Berlin-Brandenburg
Photonix
RFID Journal live
RFID tomorrow
Semicon West
Sensor & Test
Sensors Expo
sps ipc drives
Smart Systems Integration
Smart SysTech
Carbon Nanotubes Workshop @DATE 2018
Technologietag Angewandte Sensorik
Vision
Year 2019
Fraunhofer IPMS - Industry Partner Day
LiFi '19
RFID '19
Automate
Embedded World
Hannover Fair
LogiMAT
OASIS
OFC
Photonics West
RFID Journal live
Smart Systems Integration
Industry Partner Day
Lange Nacht der Wissenschaften
Laser
Sensor & Test
Semicon West
European MEMS Sensors Summit
Automotive LIDAR
RFID tomorrow
MST-Kongress
Miroctech Innovation Summit
Productronica
sps ipc drives
Photonix
TSN/A Conference
GTC
Year 2020
LiFi-Workshops 2020
Automotive Ethernet Congress
Medical Wearables
TSN/A Conference
Photonix - cancelled
Webinar MEOS
Digitaltag 2020
Vehicle Environment Detection
INDUSTRIAL production + handling
GTC
Bordnetz Kongress
Fraunhofer Solution Days
IEDM Conference 2020
Year 2021
Technology Unites
Automotive Ethernet Congress
SPIE Photonics West
Semicon Europe
Photonix
MicroFab Summit
International Conference on IC Design and Technology 2021
Medical Wearables
all about automation
TSN/A Conference
Spatial Light Modulators – Status and Potential for Holography
Year 2022
Embedded World 2022
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Welcome
Components & Systems
Computing
Memory Technology
Memory Technology
Please select which type of memory technology you would like to know more about:
Ferroelectric RAM (FRAM)
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Ferroelectric Field Effect Transistor (FeFET)
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Magnetoresistive RAM (MRAM)
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Related Links:
Energy Storage
300 mm Technology Modules & Test Chips
RF Characterization
Fraunhofer Institute for Photonic Microsystems