Fraunhofer Institute for Photonic Microsystems
Fraunhofer Institute for Photonic Microsystems
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  • Applications
    [X] Applications
    • Smart industrial solutions
      • Industrial Solutions for Logistics
      • Industrial Solutions for Production
      • Industrial Solutions for Processes
    • Bio and Health
      • Diagnostics and Sensors
      • Medical Imaging
    • Mobility
      • Automotive
      • Space
    • Evaluation Kits
      • MEMS Scanner Evaluation Kits
      • Diffractive MEMS Kit: Tilt Micro-Mirror Array
      • CMUT Evaluation Kit
      • LiFi-HotSpot Evaluation Kit
      • LiFi-GigaDock Evaluation Kit
      • Time Sensitive Networking Evaluation Kit
      • RISC-V Prozessor IP Core Evaluation Kit
  • Components and Systems
    [X] Components and Systems
    • Sensors
      • Ultrasonic Sensors
        • Capacitive Micromachined Ultrasonic Transducer (CMUT)
        • Lateral Micromechanical Ultrasonic Transducer (L-CMUT)
      • Optical Sensors
        • MEMS based Spectroscopy Systems
        • Automotive LiDAR Technology
        • Integrated Photonic Devices
        • Near-infrared spectroscopy
        • Optical Ring Resonator
        • Pyrosensors
        • Photodiodes
      • Chemical Sensors
      • Electrical Sensors
    • Data Communication
      • Li-Fi Optical Data Transmission
        • Li-Fi-GigaDock
        • Li-Fi-HotSpot
      • IP-Core Design for FPGA and ASIC
        • Digital IP Core Modules
        • Analog and Mixed Signal IP Core Modules
        • FPGA and SoC Design Services
        • Automotive Network IP Core Designs
    • Computing
      • Memory Technology
        • Magnetoresistive RAM (MRAM)
        • Ferroelectric Field Effect Transistor (FeFET)
        • Ferroelectric RAM (FRAM)
      • Energy Storage
        • Silicon Capacitors
        • Integrated Micro Batteries
      • 300 mm Technology Modules & Test Chips
        • Nanopatterning
        • Metallization
      • RF Characterization
    • Actuators
      • Mechanical Actuators
        • Nanoscopic Electrostatic Drive – electrostatic MEMS bending transducer
        • Energy Harvesting
        • Micromachined Ultrasonic Transducer
        • MEMS based Micropositioning Platforms
      • Optical Actuators
        • MEMS Scanners
        • Spatial Light Modulators
        • Tunable Microlenses
        • Liquid Crystal Waveguide
  • Cleanrooms
    [X] Cleanrooms
    • 200 mm MEMS Cleanroom
      • MEMS Technologies
        • Back End and Packaging
      • MEMS Applications
    • 300 mm CMOS Cleanroom
      • Nanopatterning
      • Atomic Layer Deposition (ALD)
      • Chemical Mechanical Planarization (CMP)
      • Wafer Metallization
      • Wafer Cleaning
      • 300 mm Wafer Services
    • Analytics and Characterization
      • Analytics and Metrology
      • RF Characterization
  • Research areas
    [X] Research areas
    • Neuromorphic Computing
      • TEMPO - Technology and Hardware for Neuromorphic Computing
      • ANDANTE - Ai for New Devices And Technologies at the Edge
      • MEMION - Memristive Redox Transistors for Neuromorphic Computer Architectures
      • StorAIge - New storage technology for edge AI applications
      • SEC-Learn - Sensor Edge Cloud for Federated Learning
      • TKOS - Terahertz-Technologies
    • Trusted Electronics
      • Velektronik - Platform for trusted electronics
      • Silhouette - Silicon Photonics for trusted electronic components
      • TRAICT II – Trusted resource aware ICT
      • TrEKISS - Trusted Edge AI for Multi-sensor systems
      • VE4 - Trusted fault management of energy networks
    • Quantum Computing
      • QUASAR - semiconductor quantum processor with shuttling-based scalable architecture
      • QLSI - Quantum Large-Scale Integration with Silicon
      • SUQCES - Manufacturing scalable and industry-compatible quantum computing approaches.
      • HalQ - Semiconductor-based quantum computing
      • MATQu - Materials for Quantum Computing
      • PhoQuant - Photonic Quantum Computer
      • QSolid - Quantum computer in the solid state
      • Qu-Pilot - Pilot production capabilities for quantum technologies
    • Quantum Communication
      • Quant-ID - Quantum Secure Identities for a Digital Future
      • QuINSiDa - Quantum-based infrastructure networks for safety-critical wireless data communication
      • MiQuE - Compact modules for mobile, free-beam quantum communication
      • QuNET & MOBIXHAP - Mobile Nodes for Quantum Communication
      • QuNET & FuNK - Compact optical communication systems for quantum-safe information exchange between authorities
    • Green ICT / Green IT
      • Environmentally friendly cleaning technologies in microchip production
      • Environmentally compatible slurries
  • Media Hub
    [X] Media Hub
    • Press Releases
      • Archive
      • Year 2020
        • Optical microsystems
        • X-ray photoelectron spectrometer at Fraunhofer IPMS
        • Real-time communication for automobiles
        • Covid-19 Statement
        • Micro loudspeaker made from silicon
        • NED audio technology for the market
        • Fraunhofer IPMS presents communication solutions for modern production
        • Fraunhofer IPMS develops IP designs for data control
        • Fraunhofer IPMS develops TSN Switch IP Core
        • M3 Infekt - Decentralized monitoring of COVID-19 patients
      • Year 2019
        • Press Release 2019-02-07
        • Press Release 2019-02-12
        • Press Release 2019-03-13
        • Press Release 2019-03-14
        • Press Release 2019-03-21
        • Press Release 2019-03-28
        • Press Release 2019-04-02
        • Gesture Recognition Using Ultrasound
        • Machine Perception - Scanning Eye Providing Robot Sight
        • Top marks for plastic bottle recycling system
        • Low-power Chips for AI Applications
        • More safety for driver assistance systems
        • Membrane-free MEMS Loudspeakers in Nature Microsystems and Nanoengineering scientific journal
        • Wireless and battery-free RFID sensor for switchgears
        • LiDAR technology for autonomous driving
        • Investments for Beyond-Moore process development and evaluation on 300 mm wafers
        • Wireless real-time communication via light - Wireless TSN via Li-Fi
        • Energy-efficient AI system
      • Year 2018
      • Year 2017
      • Year 2016
      • Year 2015
        • Press Release 2015-04-17
      • Year 2014
      • Year 2013
      • Year 2012
      • Year 2011
      • Year 2010
      • Year 2009
      • Year 2008
      • Year 2007
      • Year 2021
        • TSN IP core designs with low latency for automotive on-board networks
        • Fraunhofer IPMS is part of the European project ASCENT+
        • Thinking chips: Advanced materials and hardware for next generation computing
        • Scalable silicon qubits for quantum computers
        • Sensor platform for IoT and edge computing solutions
        • Trusted Electronics (Project Velektronik)
        • Energy-efficient sensor nodes from Fraunhofer
        • Ultrasonic measurement technology of the future
        • Towards a quantum processor "made in Germany"
        • Ultrasound sensor platform for SMEs
        • Reinforcement of the Institute Management at Fraunhofer IPMS
        • Project Silhouette launched
        • Terahertz technologies for visionary innovations
        • RISC-V Functional Safety Processor IP Core introduced by Fraunhofer IPMS and CAST
        • Innovative modeling approach for micro loudspeakers
        • Fraunhofer IPMS RISC-V processor core for functional safety
        • Stable European industry-scale fabrication value chains for solid-state-based quantum computer developmen
        • International Conference on Design and Technology in the IC Industry
        • Industrial automation and communication of the future
        • Zepowel: Das Internet der Dinge wird grüner
        • Fraunhofer IPMS presents a scalable TSN multiport switch at the TSN/A conference
        • Innovative Forschung soll Unternehmen in dünn besiedelten Regionen unterstützen
        • Noise-indicating lamp
        • Fraunhofer IPMS presents new technologies at the MST Congress
        • Innovative technologies for the industry
      • Year 2022
        • Risc-V-IP-Core-EMSA5-Lauterbach
        • Near infrared spectral analysis for mobile applications
        • Fraunhofer IPMS develops CANsec Controller IP-Core CAN-SEC
        • Fraunhofer IPMS develops demonstrator with gesture control for OZEANEUM in Stralsund
        • Miniaturized components of Fraunhofer IPMS
        • Trustworthy electronics "Made in Germany"
        • Kick-off for the "Green ICT @ FMD" competence center
        • Miniaturization saves energy in industrial automation
        • Modular high-throughput micro-platform for mass data storage of the future
        • Li-Fi GigaDock® Transceiver on ISS space station
        • Fraunhofer IPMS presents 200 and 300 mm technologies
        • Sensor and actuator-based signal preprocessing using AI-based methods
        • Photonics - Shining technology of the future
        • Research Fab for quantum and neuromorphic computing
        • Push-pull principle for loudspeaker concept
      • Year 2023
    • Annual Reports
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    • Scientific publications
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  • Events
    [X] Events
    • 2016
      • ECOC 2016
      • Electronica
      • FachPack
      • Lange Nacht der Wissenschaften
      • Optatec
      • Semicon Europa
      • Semicon West
      • Sensor & Test
      • Sensors Expo
      • sps ipc drives
      • Vision
      • CNT - Industry Partner Day
    • Year 2017
      • Jahrestagung der DGaO
      • Embedded World
      • European MEMS Sensors Summit
      • Lange Nacht der Wissenschaften
      • Laser
      • LogiMAT
      • MST-Kongress
      • OFC
      • Photonics West
      • Photonix
      • RFID tomorrow
      • Sensor & Test
      • Sensors Expo
      • Smart Systems Integration
      • Semicon West
      • Semicon Europe
      • sps ipc drives
      • Fraunhofer IPMS - Industry Partner Day
      • Workshop LiFi
    • Year 2018
      • Analytica
      • Electronica
      • Embedded World
      • European MEMS Sensors Summit
      • Global LiFi Congress
      • Hannover Fair
      • IDTechEX
      • Lange Nacht der Wissenschaften
      • LogiMAT
      • OFC
      • Optatec
      • Photonics West
      • Photonik-Tage Berlin-Brandenburg
      • Photonix
      • RFID Journal live
      • RFID tomorrow
      • Semicon West
      • Sensor & Test
      • Sensors Expo
      • sps ipc drives
      • Smart Systems Integration
      • Smart SysTech
      • Carbon Nanotubes Workshop @DATE 2018
      • Technologietag Angewandte Sensorik
      • Vision
    • Year 2019
      • Fraunhofer IPMS - Industry Partner Day
      • LiFi '19
      • RFID '19
      • Automate
      • Embedded World
      • Hannover Fair
      • LogiMAT
      • OASIS
      • OFC
      • Photonics West
      • RFID Journal live
      • Smart Systems Integration
      • Industry Partner Day
      • Lange Nacht der Wissenschaften
      • Laser
      • Sensor & Test
      • Semicon West
      • European MEMS Sensors Summit
      • Automotive LIDAR
      • RFID tomorrow
      • MST-Kongress
      • Miroctech Innovation Summit
      • Productronica
      • sps ipc drives
      • Photonix
      • TSN/A Conference
      • GTC
    • Year 2020
      • Photonix West
      • LiFi-Workshops 2020
      • Sensor und Test
      • Lange Nacht der Wissenschaften Dresden
      • Embedded World 2020
      • Hannovermesse
      • Automotive Ethernet Congress
      • MEMS & Imaging Sensors Summit
      • Medical Wearables
      • Industry Partner Day 2020
      • Corona
      • Semicon West
      • TSN/A Conference
      • electronica
      • Semicon Europe
      • COMPAMED
      • Optatec
      • Photonix - cancelled
      • SPS
      • Webinar MEOS
      • Digitaltag 2020
      • Vehicle Environment Detection
      • INDUSTRIAL production + handling
      • GTC
      • Bordnetz Kongress
      • Fraunhofer Solution Days
      • IEDM Conference 2020
    • Year 2021
      • Technology Unites
      • Automotive Ethernet Congress
      • SPIE Photonics West
      • SPIE Photonics West
      • Semicon Europa
      • Photonix
      • MicroFab Summit
      • International Conference on IC Design and Technology 2021
      • Medical Wearables
      • all about automation
      • TSN/A Conference
      • SPIE Photonics West
      • Spatial Light Modulators – Status and Potential for Holography
      • Webinar: Material development for MRAM and FRAM stacks
    • Year 2022
      • Embedded World
      • SPIE Photonics West
      • Sensor + Test
      • OFC
      • analytica
      • MEMS Manufacturing
      • Laser - World of Photonics
      • Dresden Science Night
      • All About Automation
      • World of QUANTUM
      • Semicon Europa
      • MEDICA
      • Photonix
      • electronica
      • MEMS & Imaging Sensors Summit 2022
    • Year 2023
      • SPIE Photonics West
      • OFC 2023
      • embedded World 2023
      • Sensor + Test
      • Laser - World of Photonics
      • MikroSystemTechnik Kongress
      • Semicon Europa
      • MEDICA
      • Night of the Sciences Dresden
      • Photonix
    • Year 2024
      • SPIE Photonics West
      • analytica 2024
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    • Year 2019
    • Sensor & Test

    Trade Fair

    Nürnberg, Deutschland  /  June 25, 2019  -  June 27, 2019

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    Source: Fraunhofer-Gesellschaft
    Fraunhofer Institute for Photonic Microsystems - Sensor & Test

    Online in Internet; URL: https://www.ipms.fraunhofer.de/en/events/2019/sensor_und_test.html

    Date: 27.9.2023 01:33