Characterization and Test

200 mm Wafer Characterization and Test Services for MEMS and MOEMS

Fraunhofer IPMS Dresden researches, develops and manufactures innovative intelligent microsystems (MEMS / MOEMS). These are micromechanical optical systems that combine sensors, actuators, digital and analog circuit components.

The combination of electrical and non-electrical properties in these systems is a challenge for testing and characterization. In addition to the classic electrical test methods, non-electrical, primarily optical measurement and stimulation methods are used. The tests are carried out under class 10 clean room conditions. Planning, test program development and test execution are carried out in close coordination with our clients.

The integration of special devices such as laser vibrometers, spectrometers, interferometers or colour measurement cameras allows the combined electrical and mechanical/optical characterization of these microsystems. The electrical control is carried out with mixed-signal test systems, which enable convenient program creation, great flexibility and high test coverage.

Our test solutions are usually developed on a project basis as part of the product development process and are ready for series production at the customer's request.

To support SMEs, however, we also offer test development and testing as a separate service for small and medium quantities.

We offer the following types of characterization & test

Electrical Characterization

© Fraunhofer IPMS
Characterization at wafer level

To characterize the complex devices and technologies, Fraunhofer IPMS is able to perform the following measurements (in-/ex-situ) both at wafer level and on the individual device:

Mixed-signal testing
Parametric test system
Electro-optical test system for micro-displays and sensors
Sensor-actuator test system
Non-electrical test
CV analysis
Insulator integrity and reliability characterization
More: Datasheet Electrical Characterization

Automatic Optical Inspection

Our chips often have optically or sensorically active surfaces or tiny mechanical structures that require high quality, but which cannot be tested electrically. Therefore, optical inspection is required.

Small numbers of such chips can be visually inspected and selected under a microscope, but this method is no longer effective for large numbers. For this reason, Fraunhofer IPMS has developed and set up test equipment that optically inspects microsystem wafers.

Examples of tested chips:

MEMS / MOEMS components
Multi-field photodetectors for optical measuring systems
Organic light emitting diodes (OLED)

More: Datasheet Automatic Optical Inspection

Inline Characterization

MRS Reinraum Charakterisierung und Test CAT — © Fraunhofer IPMS

Optical coating thickness measurement
Inline reflectance measurement
Scanning electron microscopy
CD-SEM
Atomic Force Microscopy
Ellipsometry
White light inferometer
Laser scanning microscopy
Defect measurements
Ultra-high frequency vibrometry

Metrology

Film Thickness Measurement

Optical Thickness Measurement
In line Reflectance

CD-SEM

Ellipsometer

Optical Properties

Defect Measurement

Defect Inspection
Defect Classifcation

Inspection

Scanning Electron Microscope

3D Inspection
Analysis SEM with FIB cut

Surface Topology Measurement

Atomic Force Microscope
White Light Interferometer
Laser Scanning Microscope

Actuation Measurement

Ultra high frequency vibrometer

MRS Reinraum Inline Messtechnik — © Fraunhofer IPMS

Our 200 mm Equipment and Process Capabilities

Characterization and Test

Category	Application / Capability	Equipment / Model	Manufacturer
Film Thickness Measurement	Optical Thickness Measurement of Standard Materials	Lambda Ace RE-3300	Screen
Film Thickness Measurement	Inline Reflectance measurement	n & k Olympian
Scanning Electron Microscope	3D Inspection	JSM-6700F	JEOL
Scanning Electron Microscope	Analysis SEM with FIB cut	Helios Nanolab 660	FEI
CD-SEM	CD Measurement	Verity Lite	Applied Materials
Atomic Force Microscope	Surface Topology	Nanoscope D3100	Veeco
Atomic Force Microscope	Surface Topology with automated handling	NX-Wafer	Park Systems
Surface Characterization	Contact angle measurement	DSA100W	Krüss
Ellipsometer	n&k Measurement, Optical Properties	V-VASE (190 ... 1700 nm)	Woollam
White Light Interferometer	Surface Topology	NT8000	Veeco
Wafer Inspection	Bright Light Optical Inspection	Axiospect 302	HSEB
Defect Measurement	Defect Classification	FAaST 230	Semilab
Defect Measurement	Defect Classification	INS3000	Leica
Defect Measurement	Defect Inspection	Compass Pro	Applied Materials
Profilometer	Step height, mapping, 3D imaging of surfaces	surface Profiler P16+	KLA Tencor
4-point measuring station	Sheet resistance	CDE ResMap168	veonis technologies
Stress measurement	Wafer bow, wafer stress, temperature dependent	FSM500-TC-R	Frontier Semiconductor
Wafer measurement	Wafer thickness, stress, Bow, trench depths, layer thickness measurements	SemDex M2	sentronics metrology
X-ray diffractometer	XRR, XRD	Siemens D5000	Siemens
Mixed Signal Testing	72 digital pins (200 MHz), 32 analog pins, 6 x 52 V / 0.2 A supply, 51 V / 5 A supply, various digitizers & generators, wafer size 4, 5, 6, 8, 12 inch; temperature: -40 ... +125°C	M3650 / EG4090µ / UF3000EX	Advantest
Mixed Signal Testing	176 digital pins (200 MHz), 24 analog pins, 8 HV bus pins, 6 x 52 V / 0.2 A supply, 2 x 80 V / 20 A supply, various digitizers & generators, wafer size 4, 5, 6, 8, 12 inch; temperature: -40 ... +125°C	M3670-Falcon / EG4090µ+ / PA300	Advantest
Mixed Signal Testing	512 digital pins (200 Mbit/s), 32 analog pins +80 V ±200 mA, 8 HV pins 60 V / 10 A, various digitizers & generators, wafer size 4, 5, 6, 8, 12 inch; temperature: -40 ... +125°C	V93000 SmartScale / EG4090µ / UF3000EX	Advantest & Cascade Microtech
Parametric Test System	48 channels, wafer size 4, 5, 6, 8, 12 inch; temperature: -40 ... +125°C	B1500 / EG4090µ / UF3000EX	Keysight
Parametric Test System	Matrix up to 72 channels, wafer size 6 ... 8 inch; temperature: -40 ... +125°C	S530 basic EG4090µ	Keithley
Electro-Optical Test System for Micro Displays and Sensors	Color & luminance measurements, DUT images up to 16 Mpix, wafer size up to 12 inch; capabilities for bare dies or modules; temperature: -40 ... +125°C	F1600C Pike Camera, 20 Mpix IDS Color Camera, Spectrometer Jeti Specbos 1211UV, PA300	Formfactor
Sensor Actor Test System for MEMS / MOEMS	Wafer size 8 inch; temperature: 15 ... 125°C; SMU, laser light barriers, frequency counter, switch matrix, up to 72 channels	AP200	Formfactor; changeable chuck-addons for MEMS probing
Optical Inspection	Manual or fully automated image processing	PA200	Formfactor
Non-Electrical Test	Up to 20 channels, configurable set points -45°C ... 145°C @ 1.4 deg/min; rH controlled; 300 N sine; up to 5000 g pulse	pH Sensor Tester; Thermal Calibration; Shock and Vibration	Fraunhofer IPMS; Feutron ESPEC; LDS; Endevco
CV Analysis	Oxide thickness, flat band voltage, effective oxide charge, average bulk doping, threshold voltage, Debye length, interface trap density	B1500, HP4294A, HP4295A, K590	Keithley, Keysight
CV Analysis	Relaxation time, minority carrier lifetime, surface scan velocity	HP4294A, HP4295A, K590 and K595 (TVS)	Keithley, Keysight
Characterization of Insulator Integrity and Reliability	Breakdown field, Weibull plot, Time / charge to breakdown (Eramp and Econst (TDDB))	K236, K237 and K238	Keithley

Charactization and Test

200 mm Characterization and Test

200 mm Wafer Characterization and Test Services for MEMS and MOEMS

We offer the following types of characterization & test

Electrical Characterization

Automatic Optical Inspection

Inline Characterization