In the field of microdisplays and sensor technology, we offer our customers a variety of processes on silicon CMOS for research, development and pilot production of OLED microdisplays and sensors. These processes are available under clean room conditions. Our work focuses on the production of thin films in the nanometer to micrometer range for light emitters and photodetectors as well as their structuring. We have various systems and processes for this. In addition, analytical methods for layer characterization are also available.
- Combinability of different processes
- Thin film encapsulation
- Wafer encapsulation processes, positioning accuracy ± 1µm
- Thin film deposition, structuring and analysis at wafer level (200 mm)
- 300 m² clean room class 10
- Pilot line OLED/OPD-on-CMOS
- Systems for etching, sputtering, spin coating
- Deposition by thermal evaporation, electron beam, Vitex/Barix™, thin-film encapsulation
- Automated wafer bonding system
- Photolithography
- Ellipsometer
- Wafer prober (including a wafer prober provided by EVERBEING INT'L Corporation)