QSolid - Quantum computer in the solid state

QSolid - Quantum computer in the solid state

Duration: 2021 - 2026

© FZ Jülich
Cryogenic setup and control of a superconducting quantum computer at Forschungszentrum Jülich.

Building a complete quantum computer based on cutting-edge technology from Germany is the goal of the joint project QSolid. Together with 24 German research institutions and companies and under the coordination of the Research Center (FZ) Jülich, Fraunhofer IPMS is working on a quantum computer with improved error rates. The aim is to make Germany a world leader in quantum technology and to open up numerous new applications for science and industry. The first demonstrator will go into operation in mid-2024 and make it possible to test applications as well as benchmarks for industry standards.

 

The project focuses on quantum bits - qubits for short - of very high quality, i.e. with a low error rate. Envisioned is a system containing various quantum processors based on superconducting circuits with reduced error rates. The approach is considered a world leader and is also being pursued by Google, IBM and Intel, among others. The multiprocessor machine at FZ Jülich will run at least three different quantum chips in parallel: a "moonshot system" whose computing power exceeds that of classical supercomputers, an application-specific designed system that is already suitable for industrially useful quantum computations, and a benchmarking platform that is primarily focused on the development of digital twins and industrial standards.

 

Fraunhofer IPMS contributes its expertise in state-of-the-art, industry-compatible CMOS semiconductor fabrication in 300 mm wafer standard. This will enable scalable quantum processors that build on the achievements and advantages of silicon-based semiconductor manufacturing. This concerns, for example, manufacturing processes such as deposition and nanostructuring or electrical characterization at wafer scale. Together with GLOBALFOUNDRIES and Fraunhofer IZM-ASSID, an interposer technology is being developed that focuses on high-density superconducting interconnects and thermal decoupling through advanced packaging. In addition, cryogenic characterization of GLOBALFOUNDRIES' CMOS technology for scalable control will be performed.

Funded by the German Federal Ministry for Education and Research