Fast Innovation through Research in Semiconductor Technologies
EUREF-Campus Gasometer
EUREF-Campus 17
10829 Berlin
FIRST – Fast Innovation through Research in Semiconductor Technologies ist die europäische Konferenz zu Halbleitertrends, Advanced Packaging, Chiplets und strategischer Ausrichtung. Das Forum auf Entscheidungsebene bringt führende Akteur aus Industrie, Forschung und Politik zusammen, um Halbleiter-Roadmaps, heterogene Integration, Design-Infrastrukturen und die industrielle Umsetzung im Kontext des europäischen Halbleiterökosystems und des EU Chips Acts zu diskutieren. Informationen und Registrierung: first-by-fmd.de
QMI technology offers significant advantages over conventional packaging processes. This is due to the way chiplets are arranged on an active or passive wafer substrate with a shared interconnect stack. Since the interconnects are formed in the front-end-of-line process, much higher connection densities can be achieved than with traditional methods. The following benefits result:
Heterointegration into quasi-monolithic integration
The development of a compact ultrasound camera offers an effective solution to these challenges. By utilizing highfrequency sound waves, it enables contactless and threedimensional visualization, improving both patient safety and industrial efficiency. This technology opens new perspectives for monitoring and analyzing movements and positions across various applications.
Fraunhofer-Institut für Photonische Mikrosysteme