Der Technology Unites Global Summit findet vom 15. bis 19. Februar 2021 virtuell statt und bietet einen exklusiven Einblick in die aktuellsten Entwicklungen im Bereich der Mikroelektronik, MEMS, Digital Future und Smart Mobility. Seien Sie dabei, wenn am 17. Februar unser Experte Bert Kaiser über das spannende Gebiet der Ultrasonic Recognition spricht. Besuchen Sie außerdem unsere Hosted Session zum Thema Next Generation Computing und MEMS am 17. Februar und informieren Sie sich an unseren virtuellen Stand über neueste innovative Technologien. Wir freuen uns auf Sie!

Vorträge des Fraunhofer IPMS

17. Februar 09:00 Uhr - 10:00 Uhr MEZ

Hosted Session: Advanced technologies and hardware for next generation computing (NGC)

Dr. Wenke Weinreich, Dr. Benjamin Uhlig, Fritz Herrmann
Fraunhofer IPMS

 

Join Fraunhofer IPMS’ hosted session to learn all about state-of-the art technologies and hardware for next generation computing (NGC) as an enabler for AI, to get closer to human cognition. We will present to you the Fraunhofer Screening Fab, which offers semiconductor grade screening and evaluation services for materials, processes, chemicals and consumables from laboratory scale to production scale (for ULSI) for IC manufacturers and suppliers. Furthermore we share insides of the challenges in high sophisticated MEMS device development and production. We provide experienced scientists, professional wafer handling (ISO 9001) and state-of-the-art equipment for 200/300 mm wafers with short processing times for our customers to reduce costs and the time-to-market.

Don’t miss this opportunity to start your journey to development with us!

 

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17. Februar 17:15 – 17:35 Uhr MEZ 

Vortrag: All-Silicon Ultrasonic Recognition of the Environment 

Dr. Bert Kaiser
Gruppenleiter Monolithisch integrierte Aktor- und Sensorsysteme
Fraunhofer IPMS