300 mm Screening Fab Services

Atomic Layer Deposition (ALD), Cleaning, Chemical Mechanical Polishing (CMP) and Plating services for supplier and IC manufacturer.

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300 mm Value Added Solutions

for Non-volatile Memories, Low-Power-CMOS, Energy efficiency and MEMS-Sensors.

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Analytical Services

Our expertise ranges from wafer-level characterization with inline X-ray scattering methods to two- and three-dimensional device characterization.

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Center Nanoelectronic Technologies (CNT)

Project partner and customer of Fraunhofer IPMS - Center Nanoelectronic Technologies (CNT).

At the Center Nanoelectronic Technologies (CNT), Fraunhofer IPMS carries out applied research on 300 mm wafers for IC manufacturers, suppliers, equipment manufacturers and R&D partners. The Fraunhofer IPMS - CNT offers the following services on Ultra Large-Scale Integration (ULSI) level:

The Center Nanoelectronic Technologies has its own 800 m² clean room with 40 processing and analytic tools for 200/300 mm wafer and offers professional wafer handling with ISO 9001 certified contamination management for a smooth wafer exchange (short loops).

Industry standards guarantee a risk-free and quick integration of new developments and process innovations into the production lines of our customers to save costs and time. For a complete overview of all services see our process catalog.

News

Press release

Micro-energy Harvester for Self-sustaining, Integrated Chip Systems

Application

Electrochemistry in Microelectronic

Application

Next generation Ferroelectric RAM