300 mm Screening Fab Services

Atomic Layer Deposition (ALD), Cleaning, Chemical Mechanical Polishing (CMP) and Plating services for supplier and IC manufacturer.

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300 mm Value Added Solutions

for Non-volatile Memories, Low-Power-CMOS, Energy efficiency and MEMS-Sensors.

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Analytical Services

Our expertise ranges from wafer-level characterization with inline X-ray scattering methods to two- and three-dimensional device characterization.

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Center Nanoelectronic Technologies (CNT)

Project partners and customers of business unit Center Nanoelectronic Technologies (CNT).

At the Center Nanoelectronic Technologies (CNT), Fraunhofer IPMS carries out applied research on 300 mm wafers for IC manufacturers, suppliers, equipment manufacturers and R&D partners. CNT offers the following services on Ultra Large-Scale Integration (ULSI) level:

The Center Nanoelectronic Technologies has its own 4000 m² clean room with 60 processing and analytic tools for 200/300 mm wafer and offers professional wafer handling for a smooth wafer exchange (short loops).

Industry standards guarantee a risk-free and quick integration of new developments and process innovations into the production lines of our customers to save costs and time. For a complete overview of all services see our process catalog.