FlexAL® ALD system added to CMOS compatible clean room by Fraunhofer Institute for Photonic Microsystems - Center Nanoelectronic Technologies

Dresden, /

FhG IPMS-CNT’s FlexAL applications: ultra-thin integrated 3D capacitors.
Application: Ulta thin high density capacitor.

The Fraunhofer Institute for Photonic Microsystems IPMS in Dresden, Germany has installed a FlexAL system for plasma enhanced and thermal ALD from Oxford Instruments Plasma Technology in its Center for Nanoelectronic Technologies.

The fields of use for the new tool are research and development on processes for metal oxides for ultra-thin integrated 3D capacitors, the development of new and unique metal ALD processes, and as a platform with a combinatorial screening concept including in-situ metrology and standardized tests for ALD/PEALD precursor development serving gas and chemical supplying companies. Additionally the FlexAL will serve as a 200mm PEALD tool for the MOEMS pilot line at the Fraunhofer IPMS.

“The Center Nanoelectronic Technologies has a long-term experience in atomic layer deposition (ALD), which is a sophisticated process where monolayer after monolayer is built up”, comments Dr. Romy Liske, Business Unit Manager of the FhG IPMS-CNT, “ALD is the process of choice whenever precise thickness and composition control of thin films in the nanometer range are required. This is particularly the case for semiconductor devices where the smallest dimensions of some tens of nanometer are fabricated, and an increasing demand is observed for high conformal thin ALD films. Consequently, the development of materials and compounds deposited by ALD increases impressively.”   

After a rigid tendering process the Oxford Instruments FlexAL PEALD system was chosen because of its capabilities as a high end ALD research and development tool. The broad range of processes enabled by the FlexAL’s design allows the combination of plasma and thermal processes in one fully automated recipe as well as the flexible precursor cabinet which enables effective combinatorial precursor screening with in-situ metrology.

“The proven performance and versatility of the Oxford Instruments FlexAL together with the availability of multiple room temperature variants of PEALD processes made it the ‘system of choice’ for the Center for Nanoelectronic Technologies. We are extremely pleased to be supplying this prestigious research institute with this,” says Dr. David Haynes, Sales, Service and Marketing Director, Oxford Instruments Plasma Technology.


About Fraunhofer IPMS - Center Nanoelectronic Technologies (IPMS-CNT)

With 23,000 employees, the Fraunhofer-Gesellschaft is Europe's largest research organization for applied research. Fraunhofer IPMS is one of 67 facilities and serves as an example of the close collaboration between applied science and semiconductor production sites within the "Silicon Saxony" economic region. The IPMS conducts applied research on 300 mm silicon wafers for microchip producers, suppliers and research and development partners at its Center for Nanoelectronic Technologies (IPMS-CNT). IPMS-CNT provides services for process modules nanopatterning, high-k devices, Interconnects/Cu-metallization and sub-nanometer characterization. Due to extensive expertise and industry standards, developments and new processes can be quickly integrated without risk into existing customer processes to save time and minimize production costs. More information: ww.ipms.fraunhofer.de


Peter Felten, Business Development & Strategy
Phone: +49 351 2607-3046
E-mail: peter.felten@ipms.fraunhofer.de

About Oxford Instruments plc

Oxford Instruments designs, supplies and supports high-technology tools and systems with a focus on research and industrial applications. Innovation has been the driving force behind Oxford Instruments' growth and success for over 50 years, and its strategy is to effect the successful commercialisation of these ideas by bringing them to market in a timely and customer-focused fashion.

The first technology business to be spun out from Oxford University, Oxford Instruments is now a global company with over 2300 staff worldwide and is listed on the FTSE250 index of the London Stock Exchange (OXIG).  Its objective is to be the leading provider of new generation tools and systems for the research and industrial sectors with a focus on nanotechnology. Its key market sectors include nano-fabrication and nano-materials. The company’s strategy is to expand the business into the life sciences arena, where nanotechnology and biotechnology intersect.

This involves the combination of core technologies in areas such as low temperature, high magnetic field and ultra high vacuum environments; Nuclear Magnetic Resonance; x-ray, electron, laser and optical based metrology; atomic force microscopy; optical imaging; advanced growth, deposition and etching.

Oxford Instruments aims to pursue responsible development and deeper understanding of our world through science and technology. Its products, expertise, and ideas address global issues such as energy, environment, security and health.

About Oxford Instruments Plasma Technology

Oxford Instruments Plasma Technology offers flexible, configurable process tools and leading-edge processes for the precise, controllable and repeatable engineering of micro- and nano-structures. Our systems provide process solutions for the etching of nanometre sized features, nanolayer deposition and the controlled growth of nanostructures.

These solutions are based on core technologies in plasma-enhanced deposition and etch, ion-beam deposition and etch, atomic layer deposition, deep silicon etch and physical vapour deposition. Products range from compact stand-alone systems for R&D, through batch tools and up to clustered cassette-to-cassette platforms for high-throughput production processing.


Susie Williams, Marketing Communications Manager
Tel:  +44 (0)1934 837000
Email: susie.williams@oxinst.com