High-frequency signals are commonly transmitted between two circuit boards via HF connectors. Higher data rates require more complex connector constructions in order to reliably send signals. Unfortunately, it is often the case that delicately-structured HF connectors are expensive and in practice, mechanically fragile. Contacts often become bent or loose and connectors can be replugged only a limited number of times.

The Fraunhofer Institute for Photonic Microsystems IPMS has designed a Li-Fi transceiver module to replace vulnerable HF connectors on printed circuit boards and thus ensure reliable board-to-board communication. Infrared light is used as a wireless transmission medium for the exchange of high volumes of data, making it possible to transmit in excess of 12.5 GBit  per second. Data can be transmitted in half and full duplex mode. The Fraunhofer IPMS transceiver provides the same functionality as wires or connectors and is up to ten times faster than current wireless solutions using radio frequencies.

Additional advantages provided by the transceiver include reduced negligible bit error rates (<10^-11), low energy consumption and lowered cost. Fraunhofer IPMS has designed the transceiver to achieve the smallest possible dimensions of 2 × 2 × 2 mm. This new transceiver is especially suited for industrial applications in which large amounts of data need to be transmitted quickly and connectors no longer meet mechanical requirements or reliability demands.

Fraunhofer IPMS will present this new technology for the first time at the 2015 embedded world from 24 to 26 February in Nuremberg. Fraunhofer IPMS scientists will also introduce a wireless USB 3.0 demonstrator, a Li-Fi hotspot for ranges up to 10 meters and a new CAN-FD Conroller for the automotive sector. In order to test the usefulness of its products in various application areas, Fraunhofer IPMS provides relevant customer evaluation kits.

Visit the Fraunhofer IPMS exhibition at the embedded world, Hall 4, Stand 583!