300 mm Screening Fab Services

Atomic Layer Deposition (ALD), Cleaning, Chemical Mechanical Polishing (CMP) and Plating services for supplier and IC manufacturer.

more info

300 mm Value Added Solutions

for Non-volatile Memories, Low-Power-CMOS, Energy efficiency and MEMS-Sensors.

more info

Center Nanoelectronic Technologies (CNT)

Project partner and customer of Fraunhofer IPMS - Center Nanoelectronic Technologies (CNT).

At the Center Nanoelectronic Technologies (CNT), Fraunhofer IPMS carries out applied research on 300 mm wafers for IC manufacturers, suppliers, equipment manufacturers and R&D partners. The Fraunhofer IPMS - CNT offers the following services on Ultra Large-Scale Integration (ULSI) level:

The Center Nanoelectronic Technologies has its own 800 m² clean room with 40 processing and analytic tools for 200/300 mm wafer and offers professional wafer handling with ISO 9001 certified contamination management for a smooth wafer exchange (short loops).

Industry standards guarantee a risk-free and quick integration of new developments and process innovations into the production lines of our customers to save costs and time. For a complete overview of all services see our process catalog.

 

300 mm

Devices &
Value Added Solutions

• Non-Volatile Memories (NVM)

• Low Power-CMOS

• On-Chip Power Plant

• Sensor MEMS 300

 

Nanoelectronic

Analytical Services

• 300 mm Inline Metrology

• Laboratory

 

300 mm

Screening Fab Services

• Atomic Layer Deposition (ALD)

• Wafer Cleaning & Removal

• Chemical Mechanical Planarization

• Plating

News

Press release

Micro-energy Harvester for Self-sustaining, Integrated Chip Systems

Application

Electrochemistry in Microelectronic

Application

Next generation Ferroelectric RAM

300 mm cleanroom at Fraunhofer IPMS-CNT.