Pilot Fabrication

Regarding micromechanical and photonic microsystems we offer complete solutions: From conception to component right up to complete systems. This includes sample and pilot production in our 1500 m² (15,000 ft²) clean room (ISO 14644-1 class 4) with qualified processes. With the  extension of our process technology to the 200 mm wafer standard in the fourth quarter of 2015, we are able to create the conditions necessary to remain an attractive R & D service provider for More-than-Moore technologies.

The services offered by the Fabrication Department include: wafer processing; characterization and testing; assembly and interconnection technology; and coordination of external (third-party) services and supplier services. To achieve commercial-grade results from chip to integrated system, our Fabrication team  consists of 45 operators, supervisors, technicians and engineers.

The management of quality in our multi-process / lowvolume fab environment is essential, and performed according to strict PPS integrated quality management (ISO 9001), ensuring both tight cycle-time and process control, leading to high reliability and on-time delivery.

Examples for pilot fabrication at Fraunhofer IPMS can be found here.

In cooperation with Cornell University, a common tool map was created to provide customers a broader service portfolio and a trouble-free process for the commercialization of concepts and prototypes in the CMOS, Silicon Photonics, and MEMS area. Click here for the full tool map.