Fraunhofer IPMS participates in the High Performance Center »Functional Integration for Micro-/Nanoelectronics«. This center combines the competences of the Fraunhofer Institutes IPMS, ENAS, IIS-EAS and IZM-ASSIS, which are well aligned along the value chain of microelectronics and microsystems R&D. They are complemented by the related expertise available at the Technische Universität Dresden (Dresden University of Technology), Technische Universität Chemnitz (Chemnitz University of Technology) and the Hochschule für Technik und Wirtschaft Dresden (Dresden University of Applied Sciences).
The High Performance Center »Functional Integration for Micro-/Nanoelectronics« constitutes a unique platform across the participating institutes for the core competences systems design, components and related fabrication technologies, systems integration as well as assessment of reliability. This bundle of core competences is employed to address the following areas of R&D of high relevance for our industry partners:
- novel materials enabling new functionalities
- modular heterogeneous wafer systems
- platform technology for ultrasonic sensors
- integrated spectrometers and other optical systems employing nanostructured materials
- sensors and actuators for integration into machine tools.
On the basis of roadmaps we jointly identify possible opportunities for cooperation in talks with industrial customers. If the need arises, the center of excellence’s topics can be extended accordingly.
In view of a further continuation of the High Performance Center format in 2021 and beyond, the center »Functional Integration for Micro-/Nanoelectronics« participates in a road mapping process initiated by Fraunhofer with the aim to develop it into a center with a specific emphasis on technology transfer. Deriving from the scientific and technical focus of the present center, transfer into industry via contract research and pilot production will be a priority, complemented by IP licensing and support for spin-off companies.