Near Infrared Spectroscopy

Hyperspectral Imaging

Micro-optical Components & Devices

Microassembly & Microsystem Integration

Photonic Sensing

The core competencies of photonic sensor technology lie in optical design and mechanical construction as well as microassembly and microsystems integration of photonic sensor solutions. The design and implementation of hardware components for miniaturized MEMS-based spectrometer systems is a key aspect. Innovative photonic sensor solutions result from ideas, designs and the implementation of finished systems as well as the development of applications.

Miniaturized MEMS-based Spectroscopy Systems

Design of a miniaturized MEMS spectrometer.
© Fraunhofer IPMS
Design of a miniaturized MEMS spectrometer.

Fraunhofer IPMS develops miniaturized spectrometer systems for mobile use in diverse areas of applications including the agriculture and food industry, pharmaceuticals, biotechnology and medicine as well as in environmental and recycling sectors.

With a volume of only 0.6 cm³, about one fifth of the size of a normal sugar cube, making it one of the smallest NIR spectrometers in the world. Due to its compact design, a weight of less than 1g and low power consumption in the mW range, it is ideal for integration into mobile analysis devices for on-site measurements. In the realized version it addresses the NIR spectral range from 950 - 1900 nm with a spectral resolution of 10 nm.

Hyperspectral Imaging (HSI)

Hyper spectral imaging using the example of an apple.
© Fraunhofer IPMS
Hyper spectral imaging using the example of an apple.

Hyperspectral imaging combines spectroscopy and digital imaging, making it possible to quickly identify materials by means of spectral analysis while simultaneously recognizing objects. This spectral information provides these systems with advantages over the human eye and pure imaging systems.

Numerous applications of hyperspectral imaging range from the classification and sorting of synthetic materials to remote sensing in agriculture to quality control in the food industry.

With the core competencies available at Fraunhofer IPMS, customer-specific hyperspectral imaging systems can be designed, implemented and tested.

Micro-optical Components & Devices

MEMS carrier substrate.
© Fraunhofer IPMS
MEMS carrier substrate.

Optical gaps have been an important element in beam shaping in high-performance optical systems of very small size for many years. Whether in metrology, spectroscopy or photo technology, highly-accurate beam shaping (ideally in the smallest of space) is essential for the implementation of ultra-efficient maximal-performance systems.

The processes and technologies used at Fraunhofer IPMS allow for the implementation of customer-specific ultra-high precision optical gaps for beam shaping in the smallest of spaces. With a planar assembly approach and the use of advanced micro-assembly work tools, the Fraunhofer IPMS optical precision gaps enable significant performance improvement in a variety of systems and fields of application.

Microassembly & Microsystem Integration

Fully automated assembly platform: Sub-micrometer bonding system for assembly and packaging applications.
© Fraunhofer IPMS
Fully automated assembly platform: Sub-micrometer bonding system for assembly and packaging applications.

MEMS devices open new possibilities in the miniaturization of systems. System design using MEMS, electronics, optics and other photonic components and the method of assembling systems in the smallest of spaces are interdependent.

Fraunhofer IPMS stands ready to provide the expertise and equipment necessary for microassembly and microsystems integration of small series. This includes implementing 2D and 3D structures using various joining methods such as the application of adhesives and other fluids or soldering and thermocompression bonding. 

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