Publications 2018

Ali, T.; Polakowski, P.; Riedel, S.; Büttner, T.; Kämpfe, T.; Rudolph, M.; Pätzold, B.; Seidel, K.; Löhr, D.; Hoffmann, R.; Czernohorsky, M.; Kühnel, K.; Steinke, P.; Calvo, J.; Zimmermann, K.; Müller, J.

High Endurance Ferroelectric Hafnium Oxide-Based FeFET Memory Without Retention Penalty

IEEE transactions on electron devices 65 (2018), Nr.9, S. 3769-3774

Al-Falahi, F.; Müller, M.; Kolkovsky, V.; Gottzein, R.; Bonitz, J.; Hermann, S.; Kini, M.

MEMS IR Emitter based on carbon nanotubes

IR-Workshop Laser Components, 2018, Olching, Vortrag

Borcia, R.; Bestehorn, M.; Uhlig, S.; Gaudet, M.; Schenk, H.

Liquid pumping induced by transverse forced vibrations of an elastic beam: A lubrication approach

9th Conference of the International Marangoni Association (IMA), 2018, Guilin, China, 39 F.

Borcia, R.; Bestehorn, M.; Uhlig, S.; Gaudet, M.; Schenk, H.

Liquid pumping induced by transverse forced vibrations of an elastic beam: A lubrication approach

12th European Fluid Mechanics Conference (EFMC), 2018, Vienna, Austria, 39 F.

Borcia, R.; Bestehorn, M.; Uhlig, S.; Gaudet, M.; Schenk, H.

Liquid pumping induced by transverse forced vibrations of an elastic beam: A lubrication approach

Physical review fluids 3 (2018), Nr. 8, Art. 084202

Butschek, L.; Hugger, S.; Jarvis, J.-P.; Härtelt, M.; Merten, A.; Schwarzenberg, M.; Grahmann, J.; Stothard, D.; Warden, M.; Carson, C.; Macarthur, J.; Fuchs, F.; Ostendorf, R.; Wagner, J.

Microoptoelectromechanical systems-based external cavity quantum cascade lasers for real-time spectroscopy

Optical engineering 57 (2018), Nr. 1, Art. 011010

Calvo, J.; Drescher, M.; Kühnel, K.; Sauer, B.; Müller, M.; Schmidt, C.; Boui, F.; Völklein, F.; Wagner-Reetz, M.

LPCVD in-situ doped silicon for thermoelectric applications

Materials today. Proceedings 5 (2018), Nr. 4, Pt. 1, S.10249-10256

Carson, C.; Macarthur, J.; Warden, M.; Stothard, D.; Butschek, L.; Hugger, S.; Jarvis, J.-P.; Härtelt, M.; Ostendorf, R.; Merten, A.; Schwarzenberg, M.; Grahmann, J.; Ratajczyk, M.

Towards a compact, portable, handheld device for contactless real-time standoff detection of hazardous substances

Proceedings of SPIE Vol. 10624 (2018), Paper 106240F

Conrad, H.; Ehrig, L.; Kaiser, B.; Schenk, H.; Schuffenhauer, D.; Stolz, M.; Gaudet, M.; Schenk, H.

CMOS-kompatibler MEMS-Lautsprecher für Im-Ohr-Anwendungen

44. Jahrestagung für Akustik (DAGA), 2018, München, 3 S.

Dünkel, S.; Trentzsch, M.; Richter, R.; Moll, P.; Fuchs, C.; Gehring, O.; Majer, M.; Wittek, S.; Müller, B.; Melde, T.; Mulaosmanovic, H.; Slesazeck, S.; Müller, S.; Ocker, J.; Noack, M.; Löhr, D.-A.; Polakowski, P. ; Müller, J.; Mikolajick, T.; Höntschel, J.; Rice, B.; Pellerin, J.; Beyer, S.

A FeFET based super-low-power ultra-fast embedded NVM technology for 22nm FDSOI and beyond

IEEE International Electron Devices Meeting (IEDM), 2017, San Francisco, California, USA, 4 S. (erschienen 2018)

Ehrig, L.; Conrad, H.; Kaiser, B.; Schenk, He.; Schuffenhauer, D.; Schenk, Ha.

MEMS-Lautsprecher-Eine neue Klasse elektroakustischer Wandler für mobile Audio-Anwendungen

Tonmeistertagung, 2018, Köln, Vortrag

Faulwaßer, M.; Kirrbach, R.; Schneider, T.; Noack, A.

10 Gbit/s bidirectional transceiver with monolithic optic for rotary connector replacements

IEEE Global LIFI Congress (GLC) 2018, Paris, France, 8 S.

Fraunhofer-Institut für Photonische Mikrosysteme IPMS, Dresden

Jahresbericht 2017

Dresden: Fraunhofer IPMS, 2018, 92 S.

Gaudet, M.

A novel electrostatic actuator, the Nano-E-Drive, and its integration in a micropump design

Seminar "A New Type of Electrostatic Transducer, the Nano-Electrostatic Drive", 2018, Toulouse, France, 31 F.

Gehner, A.; Dürr, P.; Kunze, D.; Rudloff, D.; Elgner, A.; Heber, J.; Francés, S.; Skupsch, C.; Torlee, H.; Eckert, M.; Friedrichs, M.; Schmidt, J.; Pufe, W.; Döring, S.; Hohle, C.; Schulze, M.; Wagner, M.

Novel 512 x 320 Tip-Tilt Micro Mirror Array in a CMOS-Integrated, Scalable Process Technology

IEEE International Conference on Optical MEMS and Nanophotonics (OMN), 2018, Lausanne, Switzerland, 2 S.

Gerlich, L.; Wislicenus, M.; Koch, J.; Dhavamani, A.; Esmaeili, S.; Uhlig, B.

Cobalt integration solutions - integration (R&D accelerator)

CMC Conference, 2018, Phoenix, Arizona, USA, 32 F.

Grüger, H.; Knobbe, J.; Pügner, T.; Reinig, P.; Meyer, S.

New way to realize miniaturized complex optical systems in high volume

Proceedings of SPIE Vol. 10545 (2018), Paper 1054505

Hamelin, R.; Andrieux, G.; Chartier, I.; Roustom, B.; Healy, T.; Ali, Z.; Legrand, B.; Mayora, K.; Scholles, M.; Guerre, R.

The gateone-project: A digital innovation hub accelerating innovation through ecosystem design and product trajectory

Smart Systems Integration (SSI), 2018, Dresden, 6 S.

Heinig, A.

Design of on-chip RFID transponder antennas

Embedded world Exhibition and Conference, 2018, Nürnberg, 6 S.

Heinig, A.

Design of On-Chip RFID Transponder Antennas

Embedded world Exhibition and Conference, 2018, Nürnberg, 37 F.

Hesse, J.; Klier, D.T.; Sgarzi, M.; Nsubuga, A.; Bauer, C.; Grenzer, J.; Hübner, R.; Wislicenus, M.; Joshi, T.; Kumke, M.U.; Stephan, H.

Rapid Synthesis of Sub‐10 nm Hexagonal NaYF4‐Based Upconverting Nanoparticles using Therminol® 66

ChemistryOpen 7 (2018), Nr. 2, S. 159-168

Hohle, C.; Schulze, M.

MEMS integration on foundry-fabricated CMOS backplanes

Microsystems Technology in Germany 2018 / Mikrosystemtechnik in Deutschland 2018, Berlin: Trias Consult, 2018, S. 18-19

Holland, H.-J.

Plagiatschutz mittels RFID

12. Dresdner RFID-Symposium, 2018, Dresden, 21 F.

Kaden, C.; Langa, S.; Ludewig, T.; Schönberger, A.; Herrmann, A.; Göbel, A.; Kolkovsky, V.; Jeroch, W.; Pufe, W.

Enhancement of vertical integration density by engineered BSOI wafers

Microsystem Technologies 24 (2018), Nr. 1, S. 809-814

Kaden, C.; Schulze, M.

Monolithic integration for photonic applications: MEMS on CMOS and functional BSOI

10th Anniversary MEMS Engineer Forum (MEF), 2018, Tokyo, Japan, Vortrag

Kini, M.; Bonitz, J.; Müller, M.; Schulz, S.E.; Hermann, S.

Vertically aligned carbon nanotube films as absorption layers for IR applications

Smart Systems Integration (SSI), 2018, Dresden, 4 S.

Kirrbach, R.; Faulwaßer, M.; Schneider, T.; Ostermann, R.; Noack, A.

Automatic tracking of Li-Fi links for wireless industrial ethernet

Embedded world Exhibition and Conference, 2018, Nürnberg, 5 S.

Kirrbach, R.

Automatic Tracking of Li-Fi Links for Wireless Industrial Ethernet

Embedded world Exhibition and Conference, 2018, Nürnberg, 20 F.

Kirrbach, R.; Faulwaßer, M.; Ostermann, R.; Jakob, B.; Noack, A.

High-Speed, Cellular Li-Fi HotSpot for Real-Time Applications

Wireless Congress: Systems & Applications, 2018, München, Vortrag

Kolkovsky, V.; Stübner, R.; Gwozdz, K.; Weber, J.

Carbon-hydrogen-related complexes in Si

Physica. B 535 (2018), S. 128-131

Kolkovsky, V.; Stübner, R.

Hydrogen-related defects in Al2O3 layers grown on n-type Si by the atomic layer deposition technique

Physica. B 535 (2018), S. 171-174

Kolkovsky, Vl.; Scholz, S.; Kolkovsky, Va. ; Schmidt, J.-U. ; Heller, R.

Interaction of hydrogen with hafnium dioxide grown on silicon dioxide by the atomic layer deposition technique

Journal of vacuum science and technology B. Microelectronics and nanometer structures 36 (2018), Nr. 6, Art. 062901

Krenkel, M.; Kircher, M.; Kupnik, M.; Koch, S.

CMUT with mechanically coupled plate actuators

19th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, (EuroSimE), 2018, Toulouse, France, 8 S.

Krenkel, M.; Lange, N.; Koch, S.; Kircher, M.

Mechanically coupled capacitive ultrasonic transducer

Smart Systems Integration (SSI), 2018, Dresden, 8 S.

Krivokapic, Z.; Rana, U.; Galatage, R.; Razavieh, A.; Aziz, A.; Liu, J.; Shi, J.; Kim, H.J.; Sporer, R.; Serrao, C.; Busquet, A.; Polakowski, P.; Müller, J.; Kleemeier, W.; Jacob, A.; Brown, D.; Knorr, A.; Carter, R.; Banna, S.

14nm Ferroelectric FinFET technology with steep subthreshold slope for ultra low power applications

IEEE International Electron Devices Meeting (IEDM), 2017, San Francisco, California, USA, 4 S. (erschienen 2018)

Kühnel, K.; Riedel, S.; Mart, C.; Weinreich, W.

Reliable high-density energy storage in Si-doped HfO2 thin films on 3D-structures

20th Workshop on Dielectrics in Microelectronics (WODIM), 2018, Berlin, 2 S.

Lange, N.; Grafe, M.; Koch, S.; Kaden, C.; Schulze, M.

MEMS basierte Ultraschallwandler für die Anwendung in flüssigen und gasförmigen Umgebungen und Möglichkeiten der CMOS Integration

microTEC Südwest Clusterkonferenz, 2018, Freiburg, Vortrag

Laine, H.S.; Vahlman, H.; Haarahiltunen, A.; Jensen, M.A.; Modanese, C.; Wagner, M.; Wolny, F.; Buonassisi, T.; Savin, H.

Vertically integrated modeling of light-induced defects: Process modeling, degradation kinetics and device impact

AIP Conference Proceedings Vol. 1999 (2018), Art. 020016

Lee, J.; Berrada, S.; Adamu-Lema, F.; Nagy, N.; Georgiev, V.P.; Sadi, T.; Liang, J.; Ramos, R.; Carrillo-Nunez, H.; Kalita, D.; Lilienthal, K.; Wislicenus, M.; Pandey, R.; Chen, B.; Teo, K.B.K.; Goncalves, G.; Okuno, H.; Uhlig, B.; Todri-Sanial, A.; Dijon, J.; Asenov, A.

Understanding Electromigration in Cu-CNT Composite Interconnects: A Multiscale Electrothermal Simulation Study

IEEE transactions on electron devices 65 (2018), Nr. 9, S. 3884-3892

Liang, J.; Ramos, R.; Dijon, J.; Okuno, H.; Kalita, D.; Renaud, D.; Lee, J.; Georgiev, V.P.; Berrada, S.; Sadi, T.; Asenov, A.; Uhlig, B.; Lilienthal, K.; Dhavamani, A.; Könemann, F.; Gotsmann, B.; Goncalves, G.; Chen, B.; Teo, K.; Pandey, R.R.; Todri-Sanial, A.

A physics-based investigation of Pt-salt doped carbon nanotubes for local interconnects

IEEE International Electron Devices Meeting (IEDM), 2017, San Francisco, California, USA, 4 S. (erschienen 2018)

Lv, H.; Leitao, D.; Hou, Z.; Freitas, P.; Cardoso, S.; Kämpfe, T.; Müller, J.; Langer, J.; Wrona, J.

Barrier breakdown mechanism in nano-scale perpendicular magnetic tunnel junctions with ultrathin MgO barrier

AIP Advances 8 (2018), Nr. 5, Art. 055908

Mart, C.; Weinreich, W.; Czernohorsky, M.; Riedel, S.; Zybell, S.; Kühnel, K.

CMOS compatible pyroelectric applications enabled by doped HfO2 films on deep-trench structures

48th IEEE European Solid-State Device Research Conference (ESSDERC), 2018, Dresden, 4 S.

Mart, C.; Czernohorsky, M.; Zybell, S.; Kämpfe, T.; Weinreich, W.

Frequency domain analysis of pyroelectric response in silicon-doped hafnium oxide (HfO2) thin films

Applied Physics Letters 113 (2018), Nr. 12, Art. 122901

Mart, C.; Kämpfe, T.; Zybell, S.; Weinreich, W.

Layer thickness scaling and wake-up effect of pyroelectric response in Si-doped HfO2

Applied Physics Letters 112 (2018), Art. 052905

Mart, C.; Kämpfe, T.; Zybell, S.; Weinreich, W.

Wake-up effect of pyroelectric response in doped HfO2

Konferenz High-k oxides by ALD, 2018, Warschau, Polen, Vortrag

Mohammadian Kia, A.

Development of titanium oxide conformal thin film by atomic layer deposition

11th International Workshop on Engineering of Functional Interfaces (EnFI), 2018, Wittenberg, Poster

Mohammadian Kia, A.

3D analysis oft hin layers by ToF-SIMS

6th Dresden Nanoanalysis Symposium, 2018, Dresden, Poster

Noack, A.

Drahtlose Industriekommunikation: Li-Fi für Kurzstrecken

Elektroniknet.de, Online Ressource, 2018

Ostendorf, R.; Hugger, S.; Butschek, L.; Härtelt, M.; Dreyhaupt, A.; Grahmann, J.; Rattunde, M.; Wagner, J.

Rapidly tunable External cavity Quantum Cascade Lasers for applications in real time MIR sensing

14th International Conference on Mid-IR Optoelectronics: Materials and Devices (MIOMD-XIV), 2018, Flagstaff, Arizona, USA

Ostendorf, R.; Hugger, S.; Butschek, L.; Härtelt, M.; Dreyhaupt, A.; Grahmann, J.; Rattunde, M.; Wagner, J.

Recent advances of external cavity QCLs with MOEMS diffraction gratings

Proceedings of SPIE Vol. 10540 (2018), Paper 105401K

Polakowski, P.; Büttner, T.; Ali, T.N.I.; Riedel, S.; Kämpfe, T.; Seidel, K.; Müller, J.; Pätzold, B.

Tuning parameters and their impact on ferroelectric hafnium oxide

Materials Research Society Spring Meeting and Exhibit, 2018, Phoenix, Arizona, USA, Paper EP01.04.03

Reinig, P.; Grüger, H.; Knobbe, J.; Pügner, T.; Meyer, S.

Bringing NIR spectrometers into mobile phones

Proceedings of SPIE Vol. 10545 (2018), Paper 105450F

Roth, M.; Heber, J.; Janschek, K.

Modulating Complex Beams in Amplitude and Phase Using Fast Tilt-Micromirror Arrays and Phase Masks

Optics Letters 43 (2018), Nr. 12, S. 2860-2863

Roth, M.; Heber, J.; Janschek, K.

Spatial Beam Shaping in Amplitude and Phase for Multispectral Applications Using Binary Amplitude Modulators and Phase Masks

11th International Conference on Optics-photonics Design and Fabrication (ODF), 2018, Hiroshima, Japan, 2 S.

Rudolph, M.; Pätzold, B.; Czernohorsky, M.

Aspects of high aspect ratio silicon etching - capacitor application

VDI GMM Workshop, 2018, Erlangen, 20 F.

Rülke, S.; Beyer, V.; Zorn, W.; Meinig, M.; Wecker, J.; Reuter, D.; Deicke, F.; Clausner, A.; Werner, T.

Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications

Smart Systems Integration (SSI), 2018, Dresden, 4 S.

Sandner, T.; Grahmann, J.; Graßhoff, T.; Schroedter, R.

Micro Scanning Mirrors an Enabling Technology for Applied Optics (incl. Robotics)

SYSTEMS INTEGRATION, 2018, Alpnach, Schweiz, Vortrag

Sandner, T.; Gaumont, E.; Grasshoff, T.; Auböck, G.; Kenda, A.; Gisler, T.; Langa, S.; Herrmann, A.; Grahmann, J.

Translatory MEMS actuator with wafer level vacuum package for miniaturized NIR Fourier transform spectrometers

Proceedings of SPIE Vol. 10545 (2018), Paper 105450W

Schenk, H.; Wagner, M.; Grahmann, J.; Merten, A.

Advances in MOEMS technologies for high quality imaging systems

Proceedings of SPIE 10587 (2018), Paper 1058703

Schmidt, J.-U.; Duerr, P.; Wagner, M.

Customized micro mirror array for highly parallel industrial laser direct processing on the micro- and nanoscale

MikroSystemTechnik Congress, 2017, München, 4 S. (erschienen 2018)

Schroedter, R.; Roth, M.; Janschek, K.; Sandner, T.

Flatness-based open-loop and closed-loop control for electrostatic quasi-static microscanners using jerk-limited trajectory design

Mechatronics 56 (2018), S. 318-331

Schroedter, R.; Schwarzenberg, M.; Grahmann, J.; Sandner, T.; Janschek, K.

Repetitive nonlinear control for linear scanning micro mirrors

Proceedings of SPIE Vol. 10545 (2018), Paper 1054511

Schuffenhauer, D.; Gaudet, M.; Conrad, H.

Smart and efficient optimization of NED actuators

Smart Systems Integration (SSI), 2018, Dresden, 4 S.

Schwarzenberg M.; Schroedter R.; Kiethe, O.

Robuste Regelung von MEMS-Scannern dank integrierter Positionssensorik

Messe VISION, 2018, Stuttgart, Vortrag

Schweiger, S.; Koch, S.

A review of acoustic impedance matching methods to validate additive manufactured metamaterial for capacitive micromachined ultrasonic transducers

41st IEEE International Spring Seminar on Electronics Technology (ISSE), 2018, Zlatibor, Serbia, 7 S.

Sicker, C.; Heber, J.; Berndt, D.

Subnanometer calibration of diffractive micromirror arrays

European Optical Society Biennial Meeting (EOSAM), 2018, Delft, Netherlands, 2 S.

Sicker, C.; Heber, J.; Berndt, D.

Subnanometer calibration of diffractive micromirror arrays

European Optical Society Biennial Meeting (EOSAM), 2018, Delft, Netherlands, 22 F.

Speulmanns, J.; Zybell, S.; Mohammadian Kia, A.; Bönhardt, S.; Weinreich, W.; Liske, R.

Ultrathin Lithium Ion Diffusion Barrier for On-Chip 3D All-Solid-State Batteries

Conference "Interfaces in Energy Materials", 2018, Cambridge, UK, Poster

Uhlig, B.; Dhavamani, A.; Nagy, N.; Lilienthal, K.; Liske, R.; Ramos, R.; Dijon, J.; Okuno, H.; Kalita, D.; Lee, J.; Georgiev, V.; Asenov, A.; Amoroso, S.; Wang, L.; Koenemann, F.; Gotsmann, B.; Goncalves, G.; Chen, B.; Liang, J.; Pandey, R.R.; Chen, R.; Todri-Sanial, A.

Challenges and Progress on Carbon Nanotube Integration for BEOL Interconnects

21st IEEE International Interconnect Technology Conference (IITC), 2018, Santa Clara, California, USA, 3 S.

Uhlig, B.; Liang, J.; Lee, J.; Ramos, R.; Dhavamani, A.; Nagy, N.; Dijon, J.; Okuno, H.; Kalita, D.; Georgiev, V.; Asenov, A.; Amoroso, S.; Wang, L.; Millar, C.; Konemann, F.; Gotsmann, B.; Goncalves, G.; Chen, B.; Pandey, R.R.; Chen, R.; Todri-Sanial, A.

Progress on carbon nanotube BEOL interconnects

Design, Automation & Test in Europe (DATE), 2018, Dresden, 6 S.

Uhlig, S.; Gaudet, M.; Langa, S.; Conrad, H.; Kaiser, B.; Stolz, M.; Schenk, H.

Clamped-clamped in-plane electrostatic bending actuators in silicon-based microfluidic devices

22nd International Conference on Miniaturized Systems for Chemistry and Life Sciences (µTAS), 2018, Kaohsiung, Taiwan, 4 S.

Uhlig, S.; Gaudet, M.; Langa, S.; Schimmanz, K.; Conrad, H.; Kaiser, B.; Schenk, H.

Electrostatically Driven In-Plane Silicon Micropump for Modular Configuration

Micromachines 9 (2018), Nr. 4, 15 S.

Weder, A.; Koch, S.; Grätz, H.; Kircher, M.

Passive RFID sensors - battery-free, wireless pressure measurements

IOSense Spring School 2018, co-located event to the Smart Systems Integration Conference (SSI), 2018, Dresden, 24 F.

Weder, A.

Passive sensor transponders - wireless, battery-free sensing with RFID technology

IDTechEx Show! Conference, 2018, Berlin, 21 F.

Yang, H.; Krause, R.; Scheunert, C.; Liske, R.; Uhlig, B.; Preusse, A.; Dianat, A.; Bobeth, M.; Cuniberti, G.

Copper electroplating with polyethylene Glycol. Pt. II: Experimental analysis and determination of model parameters

Journal of the Electrochemical Society 165 (2018), Nr.2, S. D13-D22