Microassembly & Microsystem Integration

MEMS devices open up new possibilities for miniaturized system solutions. The Fraunhofer IPMS offers appropriate development services to help their customers creating innovative products. The system design with the use of MEMS, optics and other photonic components and the assembly techniques for systems with the smallest volumes presuppose each other. Hence, the Fraunhofer IPMS has the required know-how and the equipment necessary for micro assembly and offers the fabrication of small series as a service.

Scope of Service

Miniaturized NIR-grating spectrometer based on a MEMS-module
© Fraunhofer IPMS
Miniaturized NIR-grating spectrometer based on a MEMS-module.

Development and small-scale production of miniaturized systems

  • System development and realization from one source
  • Realization of designs consisting of two or more components
  • Realization of 2D and 3D system designs
  • Utilization of different bonding techniques

Technology

Sub-micron bonding systems for assembly and packaging applications
© Fraunhofer IPMS
FINEPLACER: Sub-micron bonding systems for assembly and packaging applications.

Fully automated assembly platform

  • Passive and active alignment
  • Passive placement accuracy up to ± 0,5 µm / ± 0,001° lateral
  • Sophisticated force control: (0.1 – 20) N @ ± 0,05 N resolution
  • Dimensions of structural components: (0.07 x 0.07) mm² up to (100 x 100) mm²