Highly sensitive electronic components are the drivers of modern technology. This requires increasingly complex processes in backend and packaging technology as well. Fraunhofer IPMS offers development services to help our customers create innovative products. We provide support from the design to the final module in quantities starting from one. The system design using MEMS, electronics, optics and other photonic components and the processes for assembling the systems in the smallest volumes go hand in hand. Fraunhofer IPMS has the necessary expertise in chip-package co-design and the required equipment for the backend and micro-assembly and offers as a service both individual process stages and complete development up to small series. Possible applications are MEMS and MOEMS of any kind, optical devices like laser or photodiodes, sensor or bio applications and many more.