Our in-line metrology enables us to determine physical and chemical properties of structures on 300 mm wafer with X-ray diffraction, angle-resolved X-ray photoelectron spectroscopy, spectral ellipsometry and energy dispersive X-ray spectroscopy. All our tools for wafer level analysis are stationed in a class 1000 (class 6 ISO 14644-1) cleanroom environment that meets industrial standards.
A huge number of analysis is aditionally available in the physical failure analysis labs. Our well established staff offers wafer analysis with X-ray (XPS, XRD/XRR, TXRF), electron microscopy (SEM, FIB, EBSD/TKD, TEM, EFTEM) and many more methods (AFM/PFM, FTIR, Raman, chemical). Electrical characterization complements the portfolio of products and services.