300 mm Semiconductor Processes#

300 mm Semiconductor Processes

Process and product development for nanoelectronics#

With the Center Nanoelectronic Technologies (CNT), Fraunhofer IPMS conducts applied research on 300 mm wafers for microchip producers, suppliers, equipment manufacturers and R&D partners. In the area of FEoL and BEoL we offer the following technology developments and services on Ultra Large Scale Integration level (ULSI):

Atomic Layer Deposition (ALD)

Chemical Mechanical Polishing (CMP)

Wafer Metallization

Wafer Cleaning

Wafer Services

Nanopatterning / E-Beam Lithography