300 mm Semiconductor Processes

Process and product development for nanoelectronics

With the Center Nanoelectronic Technologies (CNT), Fraunhofer IPMS conducts applied research on 300 mm wafers for microchip producers, suppliers, equipment manufacturers and R&D partners. In the area of FEoL and BEoL we offer the following technology developments and services on Ultra Large Scale Integration level (ULSI):

Atomic Layer Deposition (ALD)

Chemical Mechanical Polishing (CMP)

Wafer Metallization

Wafer Cleaning

Wafer Services

Nanopatterning