Chemical-Mechanical Planarization (CMP)

Industry matched 300 mm CMP-systems for efficient portability into large-scale production.

Chemical Mechanical Planarization (CMP)

300 mm Screening Fab Services

© Fraunhofer IPMS

300 mm CMP test wafer with pitch/density structures down to 28 nm node

© Fraunhofer IPMS

Defect maps on patterned 300 mm wafers with exemplary review SEM pictures

The CMP Process

Highly integrated circuits, like logic and memory chips, consist of many material layers. In the course of manufacturing the surfaces have to be planarized over and over again to obtain sufficient process windows for critical processes like lithography and etching. Furthermore planarization ensures defined sizes of the structures, thus in the end reliable functioning of the electronic elements. Chemical-mechanical planarization (CMP) is the state of the art to reach the necessary planarity. The continuous shrinking in the semiconductor technology goes along with a higher demand for accuracy, as well as a higher number of materials used. Therefore it is necessary to understand the various CMP processes and to develop novel processes for newly introduced materials to be able to fulfill the demands of the coming technology nodes.

 

Applications

CMP process development and optimization

CMP design for manufacturing strategy development with semiconductor product manufacturers

CMP consumables screening and characterization (Polishing pad - Conditioner - Slurry - Post CMP cleaning chemistry - Brush - Filter - and more)

CMP process characterization (Planarization - Defectivity - Removal rates, selectivity - Static etch rates - Electrical performance and reliability)

Modeling and simulation of the planarization behavior of patterned wafers

CMP wafer processing on demand

Evaluation of new equipment and materials under industry standard conditions

AMAT Semitool Raider SP | DNS FC3000 and BREWER Science flexible Labtool

Pre- and post-processing for optimization of individual process steps

Inline metrology

 

Applied Materials Refl exion LK polisher with Desica cleaner

Flexible mobile slurry system (6 x 80l):

    - 4 tanks for Platen distribution 

     - 2 tanks for Cleaner feed

Film thickness measurement tools:

    - Ellipsometer (KLA Tencor Spectra CD/FX 100)

    - 4-Point-Prober (KLA Tencor RS-100)

Surface topography measurements

    - Profi ler (KLA Tencor HRP-340)

    - AFM (Veeco X3D-AFM)

    - Mobile confocal microscope (Nanofocus μsurf)

X-Section and material analyses:

    - SEM, TEM, ToFSIMS, TXRF, XRR, XRD, etc.

Defect control

    - Blanket: KLA Tencor SP2

    - Patterned wafer: NextIn AEGIS-I

    - Review: SEM Vision G3

Wafer availability

    - Unpatterned for selevtivity and particle measurements: Si, Oxide, Cu, Ta/TaN, Co, etc.

    - Patterned for defectivity and electrical data: 28nm node CMP test chip & Custom designs via fl exible e-beam technology

Simulation capabilities

    - Modeling on different scales, esp. feature and chip scale

    - In-house developed simulation programs and routines

    - FEM based commercial software COMSOL Multiphysics

Electrical characterization

    - TEL Precio probe station (-55-200 °C, fully automated)

    - SÜSS PA300 probe station (semiautomated, flexible)

CMP

Cu Cu polish BEoL
Ta, TaN, Co Barrier polish BEoL
SiO2 , low-k, SiN Oxide polish FEoL / BEoL
SiO2 , SiN STI polish FEoL / BEoL

 

Electroplating

Cu Dual Damascene, Bumps, TSV BEoL
Cu coupons   Lab