The work in test and characterization comprises electric (analog, digital, mixed-signal) and nonelectric tests (optical, mechanical) of single chips and micro systems including simulation and measurements of physical parameters on wafer level. These tests are complemented by completely automatic or manual optical inspections. In this way, special evaluation software of the Fraunhofer IPMS guarantees an effective yield analysis of industry-related throughput. The spectrum of characterization of micro systems and their technologies reaches from the test field conceptions over the program development for the measurement of the electric parameters to the optical characterization of modules. In doing so, the Fraunhofer IPMS uses its longstanding experience in CMOS characterization for the evaluation of its own MEMS and MOMS technologies.
In order to evaluate the reliability of microsystems, scientists develop appropriate parameters as well as the required test routines, e. g. bursting strength tests in micromechanical pressure sensors or measurements of the light sensitivity of ion-sensitive FETs. On the waver level, semiconductor structures and contact systems as well as nonelectric parameters in test routines are recorded.