Ausrüstung

Fraunhofer-Institut für Photonische Mikrosysteme

Lithographie

Gerät Typ / Hersteller
Stepper NSR-2205i 14E2 | Nikon
Mask Aligner MA 150 BSA | SUSS
Nano Imprinting Stepper NPS 300 | SET
Coater / Dev-l-line SK-80BW-AVP | DNS
Spin Coater (Polyimide, BCB) Gamma 80 Spin Coater | SUSS
Spray Coater (High topology) Gamma 80 Alta Spray Coater | SUSS
Spray Coater (High topology) EV101 | EVG
UV-Stabilizer Fusion 200 PCU Polo | Axcelis
E-Beam Writer (5″, 6″, 7″ blanks) ZBA31 | Vistec
Mask Cleaner HMR900 | Hamatech

Abscheidung

Gerät Typ / Hersteller
PE-CVD (USG, PSG, BPSG, Silicon nitride) P5000 | Applied Materials
PE-CVD / SA-CVD Centura | Applied Materials
LP-CVD (Poly-Si, SR nitride, TEOS, Oxynitride) E1550 HAT 320-4 | Centroterm
PVD Sputtering (Al, TiAl, SiO2, Al2O3, a-Si, HfO2) CS400 | Von Ardenne
PVD Sputtering (Al, AlSiCu, Ti, TiN) Sigma 204 | Aviza
PVD Sputtering (Ta, Ta2O5, HfO2) Alcatel 610 | Alcatel
Evaporation (Al, SiO2) PLS 570 | Balzers

Öfen

Gerät Typ / Hersteller
Horizontal Furnace Anneal Inotherm
Horizontal Furnace Oxide Inotherm
Horizontal Furnace POCl3 Doping Inotherm
Horizontal Furnace Reflow Inotherm
RTA Heatpuls 8108 | Metron

Trockenätzen

Gerät Typ / Hersteller
Etch (Oxide, Nitride, Poly-Si, Deep Si) Omega fxP |Aviza
Etch (Al alloys) TCP 9600 | LAM
Etch (Deep Si) Omega i2L | Aviza
Resist Strip BobCat 208S | Axcelis
Resist Strip Plasma System 300 | PVA Tepla
Resist Strip (one strip system) Type1 | Axcelis

Nassätz- und Reinigungsprozesse

Gerät Typ / Hersteller
Wet Etch (Silicon oxide, Silicon nitride, Al) Ramgraber
Wet Etch (Anisotropic Si: TMAH, KOH) Ramgraber
Wet Strip Solvent Spray Tool | Semitool
Wafer Cleaning Ramgraber
Cleaning Processor (High velocity spray, Scrubber) 3300ML | SSEC

Chemisch-Mechanisches Polieren (CMP)

Gerät Typ / Hersteller
CMP (Silicon oxide, Polyimide, a-Si) MIRRA | Applied Materials
CMP (Silicon oxide, Poly-Si, a-Si) nTrepid | Strasbaugh
Scrubber DSS 200 On Track | LAM

Gasphasenätzen

Gerät Typ / Hersteller
Si Vapor Etch (XeF2) X-SYS-3B:6 | Xactix
SiO2 Vapor Etch (HF) MEMS-CET system | Primaxx

Analytik / Messtechnik

Gerät Typ / Hersteller
Film Thickness Measurement System NanoSpec 9100 and 8000 X | Nanometrics
Compass Inspection Compass Pro | Applied Materials
Scanning Electron Microscope JSM-6700F | Jeol
Atomic Force Microscope Nanoscope D3100 | Veeco
Ellipsometer VB-400 | Woollam
X-Ray Diffractometer D5000 | Siemens
Surfscan Particle Inspection Analyzer Surfscan 4500 | KLA-Tencor
Scanning Near-field Microscope SNOM MV4000 | Nanonics
FTIR MicrospectroscopySystem FTIR6700+Continuum | ThermoFischer
Tunable Diode Laser System TLB6200 | NewFocus
White-light Interferometer NT8000 Wyko |Veeco
White-light Interferometer NT1100, NT9800, NT2000 | Veeco
White-light Interferometer NV7300 | Zygo
Surface Scan µScan | Nanofocus
Vibrometer MSV 300 | Polytec
Twymen-Green-Interferometer µPhase | Fisba

Packaging

Gerät Typ / Hersteller
Wafer Saw DAD 651 | Disco
Bonder (Anodic and adhesive bonding) SB6e | SUSS
Bond Aligner BA6 | SUSS
SD Bond Aligner IQ Aligner | EVG
Dispenser Schiller
Wire Bonder Bondjet 810 | H&K

Test und Charakterisierung

Gerät Typ / Hersteller
Mixed-Signal Tester M3650, M3670-Falcon | SZ Testsysteme
Sensor Actuator Test System AP200 | SUSS
Automatic Inspection System PA200 | SUSS
Electro-optical Test and Characterization System AP300 | SUSS
Wafer Prober 6″ / 8″ EG4900µ | EG Systems